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Pradeep’s Techpoints is media partner for Leti Innovation Days 2024
CEA-Leti, France, is organizing the Leti Innovation Days 2024, June 25-27, at Maison MINATEC Congress Center, Grenoble, France. It is my pleasure to inform you all that Pradeep’s Techpoints is a media partner for the event.
The world needs lower-power, more resource-efficient electronics for an array of use cases. The semiconductor industry is excited about the recent surge in investments. It is very good news for the global semiconductor industry. It will also create unprecedented opportunities. Partnerships will be instrumental to getting relevant, robust, and reliable products to markets faster.
Seven tracks
At Leti Innovation Days 2024, there will be seven tracks. Plenary session is generally the most attended. Other tracks are on: electronics and sustainability, tech for health, 3D heterogeneous integration, sense and act, new materials for computing, and RF and telecommunications.
Besides the plenary, I recommend 3D heterogeneous integration, and new materials for computing, Of course, you have the right to choose your own tracks! 😉
Laith Altimime, President, SEMI Europe, will kick off the plenary, talking about global collaborations enabling $1 trillion by 2030. Fabio Gualandris, President, Quality, Manufacturing & Technology, STMicroelectronics, will speak about innovate, integrate, elevate your lab-to-fab fast track. Sanjay Natarajan, SVP & GM, Components Research, Intel, will discuss the future of compute: accelerating Moore’s Law innovation. David Anderson, President, NY CREATES, and former SEMI USA President, and Coby Hanoch. CEO, Weebit Nano, also have presentations.
Electronics and sustainability track has sessions on water resource and climate resource, respectively. Tech for health track has sessions from Thales, Injectpower, Travera, CEA-Leti, etc. 3D heterogeneous integration track has speakers from Cerebras Systems, IBM Research, Lightmatter, etc. Talks will also be delivered by Prophesee, Siemens EDA, IBM Quantum Computing, CERN, Aledia, etc.
Sense and act track has speakers from STMicroelectronics, TDK, Philips MEMS Foundry, Bosch Sensortec GmbH, Horiba, Leti, etc. New materials for computing track has speakers from Intel, CEA, Aixtron, Tokyo Institute of Technology, ASM, Applied Materials, University of Tokyo, Merck, etc. Finally, the RF and telecommunications track has speakers from Soitec, Leti, Murata, Stellantis, HPE, etc.
The tech exhibition will have 50+ live presentations. One-health demonstrators and CEA-Leti will show technologies for medical imaging, medical devices, pharma, biotech R&D, and environmental monitoring for improved human, animal, and environmental health. Also on display would be the latest silicon breakthroughs and smart system solutions. Startups are crucial to getting new technologies from labs to the market. This year, you don’t want to miss the new LiDAR, sensing, and health startups.
CEA-Leti partners span the entire semiconductor value chain. Partners’ Corner will make their expertise available in one convenient location. CEA-Leti is supported by Carnot network of French RTOs. CEA is a key player in R&D and innovation in four key areas. These are: defense and security, low carbon energies (nuclear and renewables), tech research for industry, and fundamental research in physical sciences and life sciences.
This is my second appearance as media partner, having earlier been associated with Asia Photonics Week 2024, Singapore, March 2024.
Look forward to seeing you all in Grenoble! 😉
MWC 2024 will see AI as surprise; Open Gateway, and questions about AI PC!
Unwrapped Digital Event series organized a preview session on the upcoming Mobile World Congress 2024. It dived into the hot topics likely to dominate discussion at this year’s MWC24. Analysts predicted the big themes to emerge from the show, and topics you need to keep an eye on throughout the week in Barcelona, Spain.
The panelists were: Ben Wood, Chief Analyst & CMO, CCS Insight, Peter Jarich, Head of GSMA Intelligence, GSMA, and Carolina Milanesi, President & Principal Analyst, Creative Strategies. Sasha Twining, MWC Live, was the moderator.
Ben Wood, CCS Insight, said we are all looking down at Barcelona in the coming weeks. It’s a testament to the success of our industry. Peter Jarich, GSMA, added that it is the work part that is challenging and enjoyable. Carolina Milanesi, Creative Strategies, stated you can get a lot done at the show. The quality of the people who attend are very high.
AI will come as a surprise!
Jarich said AI will come as a surprise for everyone. ChatGPT was introduced at the end of 2022. A year later, we have a much better idea of how operators in the mobile industry can take advantage of it. Now, we are talking about AI chips. There will be AI for networks, automation, etc. Its going to be a part of everyone’s agenda.
Milanesi noted that everybody is talking about AI. We prefer ML as well. It will be very interesting to see uses cases in Barcelona. With AI, everybody, and every aspect of our lives is going to be impacted. We have to learn to live with apps and services.
Ben Wood apprised that there is still lot of negative-ity around AI. It is going to drive growth, and add to productivity. People are hanging AI on everything! There is AI-washing and AI-rinsing going on. Analysts will try to cut through what is being shown, and what value is being added. There is a great responsibility on the industry to not just talk about AI, but explain the tangible benefits that come with it. Every theme at MWC will have some kind of AI.
Jarich said AI will definitely become part of business models. ChatGPT, GenAI, etc., are being put in the hands of everyone. We need to be also looking at: is it using chatbots, any other activity? Is it going to be used around services? Have we figured out what are the right type of services? There are a bunch of steps out there, and no one has figured out what is the next step, especially, for the operators. Right now, operators do not think it is part of their RoI. Another concern is: how am I going to make money with this?
Milanesi said that from an operator perspective, there may be suggesting services to customers. There is lot of opportunity with AI. However, we need to go in with eyes wide open. We need to ensure sustainability, fairness of use, inclusion, etc., are top of the mind.
Wood said there will also be regulation around AI. Some businesses are nervous as the technology is way ahead of their services. We need to wait before regulation also catches up with AI. Scaling, type of information being given, etc., will make people pause for some time, and give it some thought. We need to be very clear about real, tangible benefits.
On sustainability and environment
Next up was sustainability! Milanesi stated that AI comes with the power of consumption. AI can also help, and drive, sustainability. Not many people have measured the impact AI will have on sustainability. Europe is currently way ahead of USA, and even Asia, in terms of sustainability. We are seeing that carriers are running out of time.
Consumer electronics companies talk about sustainability, as well. They are also using recycled material more. We are also running out of certain elements. We are running low on some materials. Need for electronic components is also based on people. Working conditions of those folks who are mining is not just sustainable. There are going to be lots of talks around that.
Another topic is environment. Wood said this year, we would like to hear more about the infrastructure side of things. We need to learn more about how equipment is sourced, shipped, and recycled. Carriers are focusing on Scope 3 targets. So, they are laying it all on their suppliers. They may step up and say they are considering taking little margins if the suppliers meet their targets.
There are also about 5 billion inactive phones in the world. Jarich said there could be network side or power side. Scope 3 is a case for operators to look at in terms of energy efficiency. Wood added that the best thing to do is to keep phones working for longer. Milanesi stated that the key for Scope 3 is the biggest bucket. We need to be smarter, look at supply chains, and make them better and faster.
Jarich said circularity is also important, as is network infrastructure. Operators also need to look at energy efficiency. Energy does not come cheap. Wood said trend-wise, about 5 percent of iPhones are now second-hand devices globally. Smartphones are no longer as exciting as they used to be. In reality, people are now keeping their phones longer than ever. In Europe, people are keeping their phones for at least four years. Milanesi said her phone is about six weeks old.
Open Gateway provides huge opportunities
GSMA’s Open Gateway is a universal mobile network open application programmable interfaces (APIs) for developers. Open Gateway helps developers and cloud providers enhance and deploy services rapidly across operator networks via single points of access to the world’s largest connectivity platform.
Talking about Open Gateway initiative, Jarich stated it is important to work with operators and know their recent APIs, etc. API capabilities have been getting exposed for years. With Open Gateway, developers can come up with new solutions. We are going to see lot more progress this year. There will be market launches at MWC. Let’s take 5G! It is a technology that allows you to do cool things. We are still talking about mobile broadband in most cases. As an industry, we haven’t even looked at how to tap into the cool capabilities of 5G. Operators are still concerned about how to make an RoI. This can help them get there, as it is a huge opportunity.
Milanesi said last year, there were probably not enough use cases. This year, we may see more of those. We need to ensure that the pie is big enough for all of us. We also need to become much smarter in the way we work together. Jarich added that customers need to be exposed more to the APIs getting created.
Wood said that we also need to look at the DNA of networks. GSM was an amazing network that helped the mobile industry grow. CEOs of network operators are going to stand up and talk more in future. A big topic at MWC could be: how do operators get RoI on 5G networks? You can now scale across networks, allowing innovation from devices, and developers creating apps. The industry also needs some time to come together and work toward a common goal. We also need to ask developers whether the apps created have worked for them.
Launches and devices
Wood stated that there were unbelievable launch experiences in the past. MWC has now become more balanced. People still love devices that are latest and greatest. There will be broad range of stories around connected devices. You can have an ecosystem of devices that everyone is talking about. These can be around, watches, rings, glasses, etc. There can also be flying cars. They all have to be connected, anyway.
There are changes in the smartphones that have happened. You are going to see more interest in connected devices. You can see Samsung and Google, and the likes coming with their devices, and telling us what do they do.
Milanesi added there have been experiments with foldables. They are more robust. AI will, on phone and PC sides, would make everyone feel like they are power users. It will be more for people who can get work done in a timely manner.
With the current focus on AI, Microsoft is also on everyone’s minds. We can probably see AI PCs. They can probably look at all aspects of an enterprise, such as sales support, developers, etc. They can really leverage AI across all business segments. With AI PC, 2024 could well turn out to be a big year for Microsoft.
What about developers?
As per Jarich, developers have always worked on making our lives easier, be it devices, software, apps, etc. For APIs and Open Gateway, they have to become easier for the developers to use. Developers can become the new customers in the future. We also talk about AI PCs, but no one is able to still tell us what that really means, and what different things can they do apart from a regular PC! That’s very interesting! A buzzword is perhaps, being used, simply to sell certain things! 😉
Lot has happened for semiconductors in 2023!
Friends, we have reached the end of another year. Lot has happened for semiconductors this year. But, more of that later.
First, a very interesting mention about my blog stats. While I wrote about a third of articles during 2023, than what I did in 2022, the web traffic has exceeded over last year’s! Great! I can hopefully do more, with less! 😉 Thanks to all of those who stopped by to read. I will try and write more in 2024.
Chips are truly the heart of everything! In January, with Chips Acts across both USA and Europe, showed their concern about declining shares of semiconductor production, as against Asian countries. At CES 2023, digital scent and BEV made an appearance! We saw how there was innovation in immersion, with the advent of digital scent technology.
European Photonics Industry Consortium (EPIC) talked about how optical metamaterials and metalenses offer novel functions. Dr. Ms. Laurie E. Locascio, provided an update on implementation of CHIPS for America Act.
Lars Reger, NXP Semiconductors, talked about how positive incentives of the EU and US Chips Acts were for expansion of required manufacturing capacity, at ISS 2023. Mark Thirsk, Linx Consulting, stated how materials suppliers will be challenged to develop, manufacture, and deliver advanced products. American Innovation and Manufacturing (AIM) Act of 2020 looks at HFC phase down and polyfluoroalkyl substances (PFAS) regulation. Martin van den Brink, ASML, discussed holistic lithography and the road to one trillion transistors. We face the challenge of Moore’s Law chessboard. January ended with Malcolm Penn suggesting that the global semiconductor industry could drop -22 percent in 2023, with no change in the prediction from May 2022!!
In February, Industrial Advisory Committee (IAC), USA, provided an update on the USA CHIPS R&D program. IRPS 2023 announced its focus on reliability of semiconductor devices, ICs, and microelectronic assemblies. US Secretary of Commerce, Ms. Gina Raimondo, delivered a speech titled “The CHIPS Act and long-term vision for America’s technological leadership” at the Georgetown University’s School of Foreign Service. The University posted my story link, and I remain humbly obliged! Thank you!! Semiconductor Industry Association (SIA), USA, did a review of the 2022 semiconductor industry and took a look at 2023.
Masters of Digital 2023, DIGITALEUROPE, called for diverse workforce, and more participation from private sector, in March. Leading female founders in technology also discussed about closing the gap. At CERAWeek by S&P Global, Paul Marsden, Bechtel Energy, stated Inflation Reduction Act (IRA) puts very clear value on molecule of carbon.
Nils Poel, deputy head of market affairs, CLEPA — the European Association of Automotive Suppliers, talked about shifting gears on semiconductor innovation for automotive at imec, Belgium. At ASEAN Electronics and Semiconductors Summit 2023 held in the Philippines, demand for electronics and semiconductors was likely to grow in the ASEAN. At the SEMI Silicon Valley and Northeast Chapters conference, Jay Vleeschhouwer, Griffin Securities, presented on the state of EDA. The big two — Cadence and Synopsys — rule!
Jean-Christophe Eloy, Yole Développement, presented the status of the advanced packaging industry. I tried to make a point, stating, are you aware that a semiconductor fab requires significant annual investments, and has very high failure rates? International Photonics & Electronics Committee (IPEC) had a conference where they talked about how linear drive enables green all-optical connectivity for data centers.
European vision for semiconductors, was presented by Francisco Ibáñez, DG CONNECT, European Commission, at ISS Europe 2023. Guillaume Girardin, Yole Group, talked about how beyond Moore is actuating the transformation age. Photonics will be of great importance to the development of quantum technologies.
METIS addressed the skills needs of the European microelectronics industry. Dr. Michael Alexander, Roland Berger, talked about deglobalization of semiconductor supply chain. He proclaimed the European Chips Act is a good initiative, but likely insufficient. Dr. Ms. Sabine Herlitschka, Infineon, stated that key for an energy efficient world lies in new semiconductor materials. The month closed with the US Chips Act, IRA, and tax incentives: What’s in it for materials companies?
In April, European Innovation Council (EIC) organized the EIC Quantum Portfolio and Chips Act. EU-27 accounts for 121 quantum start-ups. EU also identified the challenge to support the expansion of chip design capabilities. The scope includes innovative design approaches addressing combination of different functionalities such as computing, RF, power, memory and sensing. Proposals on software development for semiconductor chip design are also considered in this challenge. Legal professionals in Greater Phoenix, USA, discussed how to apply for the first round of CHIPS Act funding.
My most popular article of the year: New world order for semiconductors is emerging, was next. The new world order is entirely dependent on technology, not warfare! Even Australia has big plans for quantum.
In May, Chips.gov and NIST unveiled vision and strategy for National Semiconductor Technology Center (NSTC). Dr. Thomas Morgenstern, Infineon Technologies, presented European Chips Act as framework for revitalizing European semiconductor ecosystem, at ASMC 2023. Thomas Sonderman, SkyWater Technology, talked about revitalizing the domestic semiconductor manufacturing. Robert Maire, Semiconductor Advisors, presented on Chips Act, China, Covid, downcycle, re-shoring, Taiwan and technology challenges — chip chaos.
ETP4HPC organized a seminar on HPC system software/application co-design strategic research agenda (SRA) 5. Malcolm Penn, Future Horizons, talked about re-shoring, HI being in the news! NIST, DoC, organized a round-table on workforce cross-sector partnerships. EU-US Trade and Technology Council (TTC) is said to be essential for achieving transatlantic shared objectives. SEMI Foundation talked about how women in semiconductors were bridging gender gap through allyship.
Come June, and Yasuo Nakane, Mizuho Securities presented the flat panel display (FPD) industry supply chain outlook at Display Week 2023. TSMC debuted N3P process, and update 2nm, and TSMC 3DFabric progress! Who can catch up? At 2023 Symposium on VLSI Technology & Circuits, multi-chiplet heterogeneous integration packaging for semiconductor system scaling was discussed. There was a workshop on how next level of spintronics is beneficial to LSIs for high performance and ultra-low power.
Semiconductor Industry Association (SIA), USA, organized a conference on how AI and semiconductors will drive innovation and productivity. Hiroyuki Mizuno, Hitachi, presented on quantum computing: from hype to game changer!
In July, ETP4HPC organized a conference on emerging technologies for HPC in Europe. Solarplaza organized a conference around lessons learned in agri-PV. European Photonics Industry Consortium (EPIC) held a conference on photonics for wearables. My article, TSMC and Samsung vs. new world order was hugely successful. Later, Nikkei Forum, Japan, organized a seminar on the untold story of the chip war, and underestimated impact of export controls.
August was a difficult month personally, as I had to deal with medical emergencies. Solar Media organized a conference around how the industry leaders optimize the performance of their renewable and energy storage assets. Industrial Info Resources (IIR) organized a seminar on global semiconductor and automotive industries. Leveraging Chips Act in Texas with industry incentives and initiatives, was widely read. Chip crisis was likely to last till 2024 forcing companies to adopt costly mitigating measures, per EC chips survey.
In September, Dr. David McKee, DTC Capabilities and Technologies Working Group, presented the stack architectural framework for digital twin platform. Road to ‘Beyond Moore’ with heterogenous integration for next-gen computing was proclaimed at 2023 Heterogeneous Integration Symposium. Future Horizons stated global semiconductor industry’s ultra-strong Q2-23 was an unexpected big surprise. KDT consultation workshop was held in Brussels, Belgium, on advanced packaging and 3D heterogeneous integration for RF/mmWave applications. Xecs called out for RD&I in electronic components and systems in Europe.
In October, there was the Solarplaza Summit, which looked at agri-PV challenges and opportunities. SEMI, USA and Forge Nano demonstrated atomic layer deposition (ALD) strengths and perceived weaknesses. Also, SEMI University demonstrated how it was addressing the industry’s workforce challenges. SEMI next had a seminar on what can we do about PFAS? IEDM 2023 was announced, with chiplets, heterogenous design as key for future devices to achieve desired PPACt. EuroHPC Joint Undertaking discussed LUMI as enabler of world-class scientific breakthroughs!
In November, there was an update on CHIPS Act implementation, and recommendations from IAC Working Groups. European Photonics Industry Consortium (EPIC) hosted a seminar on optical designs and simulations. NAPMP, CHIPS for America, declared that collaboration was critical for the success of advanced packaging, APPF.
Come December, Cleantech Group reported low-carbon hydrogen growth was rising, but needs policy support. Semiconductor Industry Association (SIA), USA, organized a conference on how collaboration between auto and chip industries fosters innovation and drives market growth. Yole Group, France, organized a conference on China’s rise as a global challenger in semiconductor industry. NIST organized CHIPS R&D Interfaces technical seminar, stating that open chiplet economy was now real.
My personal crowning glory: Pradeep’s Techpoints was announced as media partner for Asia Photonics Expo 2024, to be held in Singapore. Thanks for the support, everyone. 🙂
That’s it for this year, folks. Hope to be back with more in 2024. Ciao, Tot ziens, Au revoir, Auf Wiedersehen, Sayōnara, Annyeonghi gaseyo, Selamat tinggal, Adiós, Do svidaniya, Goodbye, Abaar esho! 🙂
Have a great new year 2024 ahead! 😉
Optical design and simulations, and dealing with systems complexity
European Photonics Industry Consortium (EPIC) recently hosted a seminar on optical designs and simulations.
Oliver Faehnle, Head, Optics Fabrication, OST University of Applied Sciences, Switzerland, and co-owner, Pandao, presented on modelling of optical fabrication chains during optical design.
Modelling optical fabrication chains
Modelling of optical fabrication chains depends on performance, optical system design, fabrication chain design, and production. It also needs human interaction. Today, there are over 360 optical fabrication technologies.
Today, you need to design for best performance, do fab chain design after optical design has been finished, and check whether fab feedback comes too late. The next stop is to balance performance and generation. We need to be modelling best fab chain. We also need instant risk and cost impact analyses during optical design.
Pandao provides optical purchasing that cuts down vendors quotes by 30 percent, minimize risk of vendors failure, and enables vendors audits. For optical production, it cuts down 20 percent on fab chains cost, does fab chain marketability analysis, enables capacity steering with one click. For optics design, it cuts down development time by factor of 2, cuts down number of meetings, and does cost impact analysis of design parameters. It also provides the necessary training for optics fab engineers.
Dealing with optical systems complexity
Emilie Viasnoff, Business Development Director, Optical Solutions Group, Synopsys, presented on how to deal with optical systems complexity?
Optics and photonics are getting from the device level to the system level. Synopsys’ driver has been consumer optical systems. Other drivers include automotive optical systems, AR/VR/MR optical systems, and aerospace and defense optical systems. We are dealing with system complexity and optimization.
AR/VR/MR is an emerging application with cutting-edge challenges and system-level constraints. AR/VR systems are collection of complex components: displays using microLEDs, holographic optical element and diffraction optical element HOE/DOE, sensors for head tracking, eye tracking, gesture tracking. There is still a long way to go despite extraordinary investments, and many important industry players.
According to IDTechEx, ‘software is nearly there, but hardware has many hurdles to overcome.’ In optics, there is bottleneck with combiner and compact camera optics. In display, there are issues with resolution and full color. In sensors, there are the emerging technologies in eye tracking and time-of-flight cameras.
For great AR/VR/MR systems, you need a great chip that is AI-enabled, fully-optimized optics, great microdisplay that can provide great images, and great cameras, leveraging metalenses. You need a simulation platform to design and test this complex system.
Synopsys Optical Platform consists of CODE V, LightTools, RSOFT, and LucidShape family. Application areas covered include imaging systems, displays including AR/VR, ADAS, and aerospace and defense. Synopsys design and simulation workflow for waveguide AR glasses includes a parametric bidirectional scattering distribution function (BSDF) as link between RSoft and LightTools.
You can also co-simulate the image quality, setting the interoperability stage for ultra-small and smart cameras. CODE V IMS analysis can understand image quality. LightTools stray light simulation can check ghost image from lens and flare caused by mechanism and sensor.
Synopsys offers design through manufacturing simulation. The simulation flow quantifies manufacturing impact on device performance. Here, metalenses are subject to patterning effects such as shape, shifted size, sidewall angle, and pillar size.
Optics have evolved to more complex systems, especially in consumer applications, such as cameras, AR/VR/MR, ADAS and A&D. Designing these optical systems needs a paradigm shift toward comprehensive simulations platforms.
Synopsys has a comprehensive portfolio to design, optimize and test, end-to-end, optical systems. Our optical design platform for multi-scale simulations is tied to Synopsys electronics platform. Beyond optics, you can go at the system-level with more simulations.
Meta optics design
Lieven Penninck, founder, PlanOpSim, talked about meta optics design software and services. The future is about nano-enabled components. Higher performance gets even more simplified, and there are miniaturized new applications. Design is costly, complex, and time consuming.
PlanOpSim supplies R&D tools to engineers and scientists that allow to unlock the maximum benefit of flat optics in a user friendly way. It offers dedicated meta-surface UI and design workflow, and high-speed and large area simulation. It also offers multi-scale simulations from nano to macroscale.
Meta-surface design workflow takes care of system model, library building, component design, ODA and system analysis, etc. An example of metalens design was design of a metalens with diffraction limited focusing and NA 0.55 for 632nm.
For meta atom optimization, there is a full maxwell solution using rigorous coupled wave analysis. Meta lens performance analysis looks at physical optics regime, flexible and fast parameter variations, direct output to manufacturing, and seamless integration to full wave calculation. Overlapping domain analysis accounts for the interaction of meta atom with neighboring structures. Local calculation avoids memory restriction of full wave calculation. ODA1 (order 2) beta release was in Nov. 2023.
Overlapping domain analysis improves meta-surface calculation accuracy, and is 18x faster than full wave calculation. PlanOpSim will be starting multi-project wafer service very soon, such as meta surface PDK. You can submit meta surface designs for manufacturing from PlanOpSim. Supported wavelength 940nm and size up to 5×5 mm.
Do industries even need 5G?
Industrial 5G Forum was held online today. The opening panel discussion was around playing devil’s advocate – do industries even need 5G? James Blackman, Global Editor, RCR Wireless welcomed the audience.
Alper Yegin, Vice-Chair of the Board, Chair of Technical Committee, LoRa Alliance, said we are involved in developing LoRaWAN. David Rolfe, Head of Product Marketing, Volt Active Data, said it took nearly 40 years to modernize manufacturing.
Nitin Kumar, Lead, 5G Core Strategy, Architecture and Engineering, Bharti Airtel, said that we are bullish about industrial 5G. It will solve most problems. 5G offers significant improvements over the previous wireless generations. It has several features supporting Industry 4.0. In fact, 5G is the future!
Airtel is currently working in the right direction. Telcos have become the new technos. They are working with different sectors, such as industrial, mining, etc. We are providing ground-breaking solutions. We are collaborating with industry experts and stakeholders. We have a strong 5G infrastructure nation-wide.
Alper Yegin, LoRA Alliance, said LoRaWAN technology can use private, public, and mobile networks. We have an open ecosystem. All three different types of networks can be integrated together. We are focused on addressing market needs. 5G is creating awareness for private network use.
David Rolfe, Volt Active Data, noted that we have customers having 10 times command and control data. It creates the requirement for high-availability. We have yet to see some of the new stuff coming up.
We are having newer apps coming in. We need to impose control on new lines of robots coming in. We can also establish campus-wide 5G networks, and then control the robots.
Yegin added that if a use case requires say, controlling robot arm on the floor, that falls outside the scope of LoRAWAN. Ultra-low cost of infrastructure make LoRaWAN easy to deploy. Industrial brands are also supporting and adopting LoRaWAN. There are several use cases that also need LoRaWAN.
What is 5G mutating into? Nitin Kumar said 5G is ideal for connecting a huge number of devices and sensors. URLLC will be a formidable technology in the future. Ultra-reliable low latency communications (URLLC) is a key feature of 5G that enables high-reliability and low-latency communication for mission-critical applications such as factory automation, autonomous driving, and virtual/augmented reality. 5G will transform industries, and drive innovation on a large scale.
Advanced packaging and 3D heterogeneous integration for RF/mmWave apps
KDT consultation workshop was held today in Brussels, Belgium, on advanced packaging and 3D heterogeneous integration for RF/mmWave applications. It organized by the CSA Pack4 EU on behalf of the KDT JU.
Martin Martens, VDI/VDE-IT, said CSA Pack4EU has booster package with the main objectives being creation of pan-European network, deliver a packaging roadmap for Europe, recommendations for next steps. It started on July 1, 2023, and will continue for 12 months. It has seven partners and 43 associated partners.
Portfolio analysis on the topic in ECSEL and KDT funding was presented by Eric Fribourg-Blanc, KDT JU. There are 125 projects ongoing, including six CSAs. Key topics include More than Moore high performance, More than Moore low power, More than Moore power, More than Moore other, computing, mobility, power smart grid, Industry 4.0, medtech, etc.
There are projects and participant communities in ECSEL-KDT. It is a fully connected network across the electronic components and systems supply chain. Heterogeneous integration is across three communities. 45 projects are with packaging activities. Key areas include MtM-RF, MtM photonics, More than Moore, etc. At the program level, Denmark at 31 percent, France at 13 percent, Austria at 12 percent, and Netherlands at 12 percent are the leaders.
There is now an evolution toward an European Semiconductor Board (governance). It has three pillars. Pillar 1 has Chips for Europe initiative. Pillar 2 is a framework to facilitate the implementation of projects aimed at ensuring EU’s security of supply, by attracting investments and enhancing production capacities, via ‘first-of-a-kind’ Integrated Production Facilities (vertically integrated production facilities) and open EU foundries.
Pillar 3 is the co-ordination mechanism between Member States and EC for monitoring supply of semiconductors, and crisis response to semiconductor shortages, estimate demand, anticipate shortages, trigger the activation of a ‘crisis stage’, and act through a dedicated toolbox of emergency measures. The European Semiconductor Board, composed of representatives of Member States, and chaired by a representative of the Commission, advises the Commission.
Chips JU has been reinforced and reoriented KDT joint undertaking. EU contribution has been immense. We are planning for lab to fab activities.
Future challenges of RF/ mmWave packaging
Ivan Ndip, Fraunhofer IZM, provided an overview on state-of-the-art and future challenges of RF/ mmWave packaging for various applications. RF/ mmWave spectrum has advantages and challenges. Advantages include large bandwidth, shorter wavelength, etc. Challenges include channel losses, due to free space path loss and losses due to atmospheric pressure, and intra-system losses.
Requirements of RF/ mmWave packaging platforms (eg. AiP) include cost, performance and function, reliability, functional scalability (eg. MIMO), and miniaturization. RF/ mmWave AiP platforms are available — flip chip-based AiP solutions on multi-layer organic and ceramic substrates. Another is die embedding-based AiP solutions on mold, glass, and PCB.
For apps above 100GHz, we need new RF/ mmWave packaging architectures/platforms, packaging materials and interconnects, RF, thermal, and thermo-mechanical design, fabrication process, and test and characterization of RF/ mmWave packages.
SMART3
SMART3 – An initiative fueling an European-based platform for advanced packaging applied to heterogeneous mixed analog / digital SiP was presented by Didier Floriot, UMS.
Europe has been missing out in the past. The gap is large, in comparison to the equivalent EU companies (OSAT). Scenarios are being investigated for industrialization as an outcome for R&D efforts in the EU. Focus is on RF/ mmWave front-end mixed-analog/digital systems supporting the EU market demands. It covers large spectrum of activities with synergies in packaging requirement. JV creation has been associated with few (4-6) shareholders, and two scenarios for leaders.
Advanced packaging is leading towards a competitive European industry. There is the IA KDT project. We have RF / mmWave front-end transceivers as technologies for integration. We considered FO-WLP-based platform. In SMART3, we have the RxTx module for 5G.
We identified fan-out/ fan-in WLP to contribute to technical challenges appropriate to market needs. Adaptation would be required. We have now set up the long-term R&D and industrial development roadmap in Europe (KTD project). IA project oriented on RF / mmWave will contribute to Gen-2 at Horizon 2027. Gen-1 will be initiated with BEOL line supported by JV.
Addressing packaging needs
Rajesh Mandamparambil, NXP, presented on addressing packaging needs toward enabling mmWave solutions. NXP’s target markets include automotive, industrial and IoT, mobile, and communications infrastructure. Secular growth drivers are likely to scale rapidly.
There is mmW spectrum for communications. The band ranges from 30GHz to 300GHz where a total of 250GHz is available. We are now undergoing the ‘G’ revolution. Each generation has been driving higher frequencies. For 6G, we expect that spectrum availability at 100+GHz. 6G max may extend to 1Tbps. NXP has portfolio of technologies to address 5G mmW requirements.
There are multiple 6G use cases. Some are multi-sensory holographic teleportation, real-time remote healthcare, autonomous healthcare systems, etc. There is joint communication and sensing (JCAS) using 6G. We can enhance network performance. We need advanced packaging solutions for mmW and beyond. Packaging solutions today have increased use of advanced packages, such as antenna-in-package (AiP), multi die, etc.
NXP has package concepts addressing mmW. It is also addressing integration challenges. Systems are now getting more complex and more important to consider for product and package. Massive bandwidth requirements are used to enable 5G/6G use cases. Packaging will be challenged to deliver higher level of integration, including antennae, signal integrity at 100+GHz, thermal performance, reliability, and leveraging new designs and materials. System-package-IC co-design is key for enhanced performance.
Chips in Europe
Eric Fribourg-Blanc, Chips JU, stated we have innovative action to support packaging and 3D heterogeneous integration for RF / mmWave apps. We have industrial pilot lines, with proposed budget of Euro 20 million. We can set up industrial pilot line for advanced packaging of RF/mmWave components and modules.
We will be delivering integrated solutions with performance significantly beyond current needs. It will be complemented by activities focusing on innovative RF packaging architectures and platforms. We will approach standardization, and any necessary enabler to reach the primary objective.
We can demonstrate impact on reduced dependence on other regions. We will show significant advances in function, performance, scalability, etc. We will address at least two specific app domains, where appropriate. We will develop flexible manufacturing environment, service-offer to prototype and manufacture SiPs, and create synergies with outcomes of the CSA project.
We will also organize activities with pilot lines established under Chips JU (pillar 1 of Chips Act), where relevant. We will promote co-operation with EU Chips Act activities under pillars 2 and 3. We will address sustainability on material consumption and energy efficiency.
EU-US TTC unlocking potential of transatlantic co-operation
EU-US Trade and Technology Council (TTC) is essential for achieving transatlantic shared objectives, including promoting the green transition, ensuring sustainable and resilient supply chains for critical raw materials, and creating an AI sandboxing environment.
DIGITALEUROPE organized a conference today, themed ‘Unlocking the potential of transatlantic co-operation: How the EU-US TTC can drive a sustainable future?’
Ms. Cecilia Bonefeld-Dahl, Director General, DIGITALEUROPE, welcomed the audience. She said that digital is scalable today. The EU-US TTC is meant for addressing technology challenges, and secure the future. Technology is at the heart of green innovation, security, and sustainability.
Digital industry has focal points in transatlantic agreement, cyber security, and green transatlantic marketplace and clean tech standards. In transatlantic agreement, we have joint roadmap for trustworthy AI and risk management. We are also looking at evaluation and measurement of AI systems. In cyber security, there is opportunity with new US Cyber Strategy and EU legislation. In green transatlantic marketplace, we have mutual access to incentive schemes. Transatlantic collaboration is on international standards. An example is the digital product passport.
There is need for critical raw materials, 6G and connectivity, and human rights due diligence. Critical raw materials demand is to increase 15-fold in a fast rollout scenario. 6G and connectivity has shared roadmap, including joint research activities. We are also upholding human rights in the supply chains. We are achieving global coherence on due diligence legislation. We also have the EU-US and Labor Dialog (TALD).
We also have exports controls co-operation, with Ukraine as a success story. We are achieving global policy coherence on minerals supply chain due diligence legislation. We also need talent for growth. We need to upskill and reskill workforce EU-US 2023 as the European Year of Skills.
Panel discussion
This was followed by a panel discussion moderated by Ms. Bonefeld-Dahl. The participants were Thibaut Kleiner, Director for Policy, Strategy and Outreach, DG CONNECT, European Commission, Ms. My Bergdahl, Director for Digital Trade and Standardization, Teknikföretagen, Ms. Pastora Valero, Senior VP, Public Policy and Government Affairs, Cisco, Michael Lally, Minister Counsellor for Commercial Affairs in Europe, U.S. Mission to the EU, Ms. Veronika Wand Danielsson, Head of Europe and North America Department, Swedish Ministry for Foreign Affairs, and Ms. Raquel Pente Costa, Director, European Consumer Affairs, Schneider Electric.
Thibaut Kleiner, DG CONNECT, said work is going on in clean tech. We are also looking at emerging technologies, with AI as a highlight. We are looking at making standards valid at both sides of the Atlantic. We are looking at connectivity, with Sweden at the forefront. We are looking at making submarine cables safe and secure.
We are also highlighting on human rights. EU-US have joined hands for Ukraine. We need to continue good work of the past year. We are looking at new initiatives. Activities around clean energy and transatlantic sustainable trade are going on. Sweden is also preparing for a great show. It is about progress and joining forces for the future.
Michael Lally, US Mission to the EU, said that Digital Europe brought us together in 2021. Secretary Ms. Raimondo had a meeting, and put us on the right path. The first TTC was held in 2021. Our economy has since gone over a rebirth, on to a knowledge economy. Sweden shares a similar history with the USA. We need to look ahead where we are at 6G and AI. There needs to be transatlantic competitiveness in the 2030s. TTC has expectations about excellent personal relations. There have been multiple leadership meetings among the leaders. US is really hitting the pace, and gaining momentum. We are working on all elements. TTC is also looking far out. We have began work on the AI roadmap in 2021. It means a lot for our democracies.
Ms. Veronika Wand Danielsson, Swedish Ministry for Foreign Affairs, noted that TTC’s strength and limitations are known. We would like some more insight on certain affairs. As a Swedish input, we have to make TTC even more concrete. We need to discuss and adapt common standards, etc. We have worked in the same environment, as USA. There has been re-transition of some companies. There are good employment opportunities in Sweden, and work is also coming from outside Sweden. Green transition can go hand-in-hand towards prosperity. We are looking at developing green standards. We are working closely with trade unions.
We also need to look at the results. We are looking at an opportunity to address digital agenda and technologies. We need to go hand-in-hand with EU and US. Things have gone quickly around AI. We need to have a critical look at AI. Sweden has been a digital society. There is also critical raw materials. We welcome this move from DE. We are also looking at roadmap for 6G and future communications. We need to find parameters for working together.
Ms. Pastora Valero, Cisco, talked about upskilling. TTC is looking at the taskforce for talent growth. Digital future can happen with a talented workforce. EU and US have to address the talent gap. We can exchange best practices. There is EU Year of Skills. Digital skills are important, along with cyber security. We can also do together for digital infrastructure, and closing the digital divide. Two barriers exist — we need to have more appreciation for workers with diverse backgrounds. We need to reskill workers. We also need to look at diversity, and support, and do more efforts. It also makes business sense. We can also provide even more opportunities, connecting talent with jobs. This is an opportunity to learn from each other.
Ms. My Bergdahl, Teknikföretagen, talked about standardization. We have good connections in Sweden. Standards are more in focus, lately. They have always been very important. The industry is also looking for ability to transfer data between US and EU. We also need to adopt common principles on AI, and definitely, international standards. We also need to strengthen trade relations. EU and US can leverage TTC to facilitate trade and international standards. They can focus on development and innovation. Cyber security is very important here. We also need to take solutions to a systematic level. Standards rely on multiple, existing standards. We need to meet economic objectives. We need to understand how different structures work. Work is being done by specialists. We need to devote time for delivering standards.
Ms. Raquel Pente Costa, Schneider Electric, stated we have close collaboration with US and Europe. Companies across the Atlantic are facilitating engagement, especially around AI and 6G. We need better alignment on data privacy and legislation. We are looking forward to work together, and scaling up. We are looking at transparency, for cyber security. We are also looking at joint declarations from both the sides regarding digital technologies. Digital passport is a key area. We need to have alignment here. We can develop common metrics on how to measure the contribution of digital across various sectors. Green Digital Coalition by EC has some case studies, and can be brought to the table.
Talking about export controls, Ms. Pastora Valero, Cisco, stated that Ukraine has been a success story. We favor multi-lateral controls, but sometimes favor unilateral. Alignment and harmonization are key for technologies. That will ensure effectiveness. We also need to reduce disparity for exporters. We need to see how export controls are impacting the industry, and welcome more dialog. We need to align on scope and processes.
Ms. Bonefeld-Dahl said that we need to make all of this operational. Ms. Danielsson, Swedish Ministry for Foreign Affairs, said we will do as much as possible for a forthcoming event in Sweden.
Do we expect an announcement at TTC? Michael Lally, US Mission to the EU, noted that we need to have TTC under the belt first. We want to figure out how to prolong the runway. There are lots to figure out, in terms of the government and industry. Member states are now focused at the right issues. In the USA, we are looking at having more jobs in chips. Some jobs will need advanced learning, while some jobs will not. It is important that we have to make this work for jobs and people.
CES 2023: Enterprise innovation, metaverse, in-vehicle experience closer than you think!
At CES 2023 in Las Vegas, USA, Steve Koenig, VP Research, Consumer Technology Association (CTA), provided the technology trends. He started with enterprise technology innovation. Lot of these are transformative for the global economy.
Global challenges confronting industry include supply chain issues that remains vulnerable. We are seeing demand for semiconductors softening this year. We are moving from chip shortage to over supply in several domains. Labor is another issue. Today, humans are nice to have. There are reports of tech layoffs. Technology could have an answer. We also have stubborn inflation and rising interest rates to cope with.
In 2023, about 60 percent of the economists have predicted a recession sometime this year. Several countries around the world are already said to be in recession. This time, growth will come from the enterprise side. 5G will be the first wireless technology that will be led by the enterprise innovation. It is useful for commercial and industrial IoT apps.
Enterprise tech innovation and metaverse
In enterprise tech innovation, we have seen transformation in cloud, AI, robotics, and cyber security. We are also seeing growth of automation and virtualization. We are going to see industrial IoT apps across the breadth of the economy. There will be rise in smart factories, automated farms, and facilities, etc., will happen in this decade. There will also be rise in metaverse apps. We need to look at 3GPP’s 5G development cycle closely.
3GPP released Rel-17 for 5G. We are now looking at 5G-Advanced for the commercial enterprises. It will bring the richest capabilities of 5G over the coming decade. There are protocols dedicated to XR app to advance opportunities in the metaverse.
Digital utilities are the new toolkit that underpin the modern enterprise. We are witnessing logistics and warehouse automation. We are also seeing increase in speed, safety, and savings. More of the dangerous jobs are being performed by machines. We are seeing the expansion of the cyber security ecosystem, as well. Now, we have reached zero trust.
Next, the metaverse is closer today, than you think! We are now seeing the metaverse of things (MoT). It is the next generation of the Internet. Here, virtualization will be critical. Web3 will bring much more compelling and interactive experience. Immersion is another area. There is lot of digital twinning, shared experiences, etc., going on. An innovation in virtualization is metaverse retail by Touchcast, etc. Touchcast has a virtualized 3D space, providing one-on-one personalized digital experiences. It is starting to happen now.
Digital scent and BEV are here!
We are also seeing innovation in immersion, especially with the advent of digital scent technology. More than 70 percent of our daily memories and emotions are triggered by smell. Scent memory lasts 70 percent longer than auditory or visual memories.
OVR Technology’s wearable scent technology, ION, can make digital experiences be more immersive, emotional, and effective. We are also looking at emerging metaverse strategies. We are looking at communication, collaboration, and transaction, as well as simulation.
We are also looking at transportation themes at CES 2023. We are now seeing EVs and the evolution of the electrification ecosystem. We are looking at battery designs and charging systems. We are also seeing an advancement of autonomous systems and apps. We are going to have a shortage of 160,000 truck drivers in the USA. How are we going to close that gap? Some autonomous trucks will come into play.
We are seeing transformation of the in-vehicle experience. Things like 5G V2X, voice control, screen-ification, retail and entertainment services, features-as-a-services (FaaS) models will emerge. There are innovations like Candela’s watercrafts and boats. We have Stellantis’ Ram 1500 Revolution BEV concept truck.
Health and sustainability
In health technology, we are seeing new concepts. We are seeing the emergence of the new home health hub with digital therapeutics, telehealth, and fitness health. There are new concepts in health tech innovation. On-demand network, mental wellness, VR, etc., are seeing a rise.
Sustainability and ESG is another trend. We are seeing growth of smart grids, supply chain, agriculture and food tech, etc. ACWA Robotics has robotics and digital solutions at the service of water distribution systems. It has clean water pathfinder, and won the CES 2023 innovation award product. We are also seeing farm of the (near) future. There are autonomous systems in the field. We have intelligent silos, connected farmers, farming robots, drones and soil sensors, etc.
Finally, gaming and services! Gaming is important for culture. It is for everyone! Gamers spend 24 hours per day on gaming today. People are spending more time in gaming. It is a medium for socialization, as gaming empowers connections. We are seeing an increase in on-demand lifestyles, as well.
Round-up 2022: War, chips, and back to overseas travels!
Year 2022 has been quite eventful! With the Russia-Ukraine war, alongside Covid-19, things have gone downward for the global semiconductor industry. Next year, we all hope that the industry bounces back much more stronger.
Semicon dip in 2023?
World Semiconductor Trade Statistics (WSTS) released its semiconductor market forecast generated in Nov. 2022. Following a strong growth of 26.2 percent in 2021, WSTS revised its forecast down to a single-digit growth for the worldwide semiconductor market in 2022 with a total size of $580 billion, up 4.4 percent, for 2022.
For 2023, the global semiconductor market is projected to decline by -4.1 percent to $557 billion, driven by the memory segment, according to WSTS. Will that happen? Let’s see!
Some categories are still expected to see double-digit year-over-year growth in 2022, led by analog with 20.8 percent, sensors with 16.3 percent, and logic with 14.5 percent growth. Memory is expected to turn negative in the forecast, and decline 12.6 percent year-over-year. In 2022, all geographical regions are seen to show double-digit growth except Asia Pacific. Asia Pacific is likely to decline 2 percent. Americas is expected to show growth of 17 percent, Europe 12.6 percent, and Japan 10 percent, respectively.
TrendForce, Taiwan, has said that YoY growth of NAND Flash demand bits will stay under 30 percent from 2022 to 2025 as demand slows for PC client SSDs. Recent headwinds in the global economy have caused a demand freeze in the wider consumer electronics market. Enterprise SSDs will succeed as major driver of demand bit growth in future. TSMC has also made moves in the USA, and now, is targeting Europe. More of that later!
Review 2022
In Jan. 2022, Future Horizons said that the global semiconductor industry grew 26 percent in 2021, and was likely to grow 10 percent in 2022. This was later revised down to 4 percent growth for 2022.
CEA-Leti organized a photonics workshop in Feb. 2022, where they talked about silicon photonics for AI, and integration of electronics and photonics. Dr. Nicky Lu, CEO and Founder, Etron, and Managing Board Director, Taiwan Semiconductor Industry Association (TSIA), spoke about start of tera-scale-integration era with optimized heterogeneous and monolithic integration at the fifth annual heterogeneous integration symposium, in Feb. 2021. Heterogenous integration impacts Silicon 3.0. Monolithic and heterogenous integration (MHI) has led to the Si4.0 era that is now ongoing.
March 2022 had HAXPES-Lab and what it can do for the electronics industry. There were key developments and implications of MWC 2022. DIGITALEUROPE, EU, had a webinar on how the Ukrainian IT industry was still standing against all odds, in March 2022.
ISQED 2022 was in April 2022, with Dr. Chi-foon Chan, Co-CEO, Synopsys discussing how to thrive in our changing environment. Digital Ts — threads, twins, technologies, and transformation, from Digital Twin Consortium (DTC), was another event.
May 2022 had MegaChips entering the US market for edge AI chips market. Display Week 2022 saw Ross Young discuss the smartphone and smartphone display market outlook. AR/VR market trends and technology outlook was presented by Guillaume Chansin, Director of Display Research, DSCC, at Display Week. It was in May that Future Horizons revised the semiconductor outlook for 2022 to 6 percent. Later, SEMI Arizona and Texas Chapters, USA, had a seminar on workforce shortage—meeting challenges for the semiconductor industry.
Semiconductor innovations
Global Semiconductor Alliance (GSA) had a conference on how diversity increases profitability. It looked at what managements can do to accelerate diversity. Honolulu, Hawaii, was the place for 2022 VLSI Symposium that looked at technology and circuits as critical infrastructure of future. Dr. Y. J. Mii, Senior VP of R&D, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), presented on semiconductor innovations, from device to system.
Intel 4 CMOS with advanced FinFET transistors optimized for high-density and HPC came to the fore, and there was a workshop on cryogenic electronics for quantum computing. CHIPKIT emerged as an agile, re-usable open-source framework for test chip development. We had the OpenROAD project — open source platform for IC design innovation at VLSI Symposium 2022. Chips in Europe looked at advancing innovation in semiconductor industry, by SEMI Europe.
BloombergNEF summit in New Delhi talked about 2-4x investment that was needed to meet the net-zero targets by 2050. Semiconductor Industry Association-Semiconductor Research Corp., (SIA-SRC), USA discussed the future of semiconductor hardware. At Automatica 2022, Siemens’ showcased NX industrial electrical design to boost engineering productivity.
In July 2022, I wrote about why more women are definitely needed in semiconductors! Boreas Technology advised how piezo haptics will create their own market by introducing novel haptic apps. At Semicon West 2022, Ms. Laurie E. Locascio, Under Secretary of Commerce for Standards and Technology Director, National Institute of Standards and Technology (NIST), talked about how all parts of the US Chips Act need to be closely co-ordinated.
Andrea Lati, Director, Market Analysis, TechInsights, mentioned the semiconductor capital spending and equipment outlook for 2022. Christian Gregor Dieseldorff, Senior Principal Analyst, SEMI, discussed the trends and forecast for fab equipment spending, capacities, and new fabs.
NASA invites me!
Dr. Michael McCreary, Chief Innovation Officer, E Ink Corp., at Flex 2022, Semicon West 2022 stated how electrophoretic display was changing the look of autos, transportation, and beyond. Dr. Dawson Cagle, Program Manager, IARPA, talked about how IARPA’s smart e-pants were weaving electronics into textiles. In July, I was invited to attend NASA’s SpaceX CRS-25 launch to International Space Station. That was really something spectacular to behold!
Dr. Ms. Kate Darling, leading expert in Robot Ethics and MIT Media Lab Research Specialist, MIT Media Lab, talked about the future of human-robot interaction at Sensors Converge 2022. SIA discussed investing in innovation: blueprint for enduring American semiconductor leadership. Silicon-based quantum computing as a disruptive paradigm, was presented by Dr. Maud Vinet, Quantum Hardware Program Manager, CEA Leti, at Scaling and Lithography Tech Talks, Semicon West 2022.
Aug. 2022 saw how the EU Chips Act was necessary for accelerated digital transformation. I clarified whether people think I am very good in semiconductors? Dr. Henning Schröder, Group Leader, Fraunhofer Institute for Reliability and Micro-integration IZM, presented on glass-based quantum photonic packaging.
Agri-PV harvesting the opportunities of solar + farming started off Sept. 2022. Quantum dot imagers bridging SWIR accessibility gap was presented at SEMI MEMS & Sensors Summit 2022. Malcolm Penn, Future Horizons, revised global semiconductor growth forecast to +4 percent for 2022; with downturn likely ahead in 2023! Let’s see!
New materials required
SEMICON Taiwan 2022 Power & Opto Semiconductor Forum addressed how new materials are required to solve technology challenges, and support growth of electronics. SEMI, USA, looked into the future of computing in 2040. Center for the Study of the Presidency and Congress (CSPC), USA organized a conference on the US Chips Act and implementation. Xecs, Europe, maintained its focus on electronic components and systems.
Oct. 2022 had a session on time-sensitive networking (TSN) and future of connectivity by the Industry IoT Consortium (IIC). Satellite quantum key distribution moving to industrialization phase was discussed by the European Photonics Industry Consortium (EPIC). I also made my first overseas trip to Dubai, post the pandemic, to attend an event.
In Nov. 2022, SEMI, Northwest Chapter, USA, organized a conference on ‘The Future of More Than Moore—Chiplets, Advanced Packaging, and More’. Ms. Amy Leong, SVP, CMO, GM Emerging Growth/M&A, FormFactor Inc., presented on strategy for wafer probe in a chiplet world. Luc Van den hove, President and CEO, imec, discussed how future of scaling needs system-level thinking and STCO at IMT 2022. Japan intimated how it was gearing up to re-transform computing power and semiconductors.
Las Vegas and KA
Las Vegas, USA, welcomed me back, again, after 15 years, for an industry event. May I also mention KA, a spectacular show from Cirque de Soleil, that I witnessed. Featuring 80 artists from around the world, KÀ is a gravity-defying production featuring powerfully emotive soundtrack that enhances the innovative blend of acrobatic feats, Capoeira, puppetry, projections, and martial arts. Great experience! I also bumped into an angel or Pari, mid-air, en route to New York. 🙂
Next, there was Semicon Europa 2022 in Munich, Germany, which included ITF Beyond 5G. Among the topics discussed were compound semiconductor epitaxy core of next-gen connectivity. Chips are now the new oil, was proclaimed by Laith Altimime, President, SEMI Europe! I cannot express how happy I am to hear this! More of it later!! There were talks about building scalable and ultra-coherent quantum computers with carbon nanotubes, metaverse, future of air travel, among topics at Semicon Europa 2022. Later, there was IEEE Standards Association (SA) workshop on 5G and beyond in New Delhi.
Dec. 2022 began with an SIA seminar that looked at the growing challenge of semiconductor design leadership. Design costs are rising with every new technology node. Moore’s Law scaling has not been keeping pace. New improvements are required in design and packaging.
There are challenges to global semiconductor manufacturing. Geopolitical tensions are creating risks of disruption and shortages. Semiconductor industry is suffering from a lack of attractiveness and qualified talent. Besides, we have global warming threat and need for sustainability programs. Countries also need to create enough incentives for manufacturing investments.
Still in Dec. 2022, the 68th International Electron Devices Meeting (IEDM) 2022 was held in San Francisco, USA. IEDM celebrated its 75th birthday this year. There were five focus sessions on advanced heterogeneous integration: chiplets and system-in-packaging, quantum information and sensing, special topics in non-von Neumann computing, DNA digital data storage transistor-based DNA sequencing, and bio-computing, and implantable-device technology.
Fusion ignition achieved
US Department of Energy (DOE) and DOE’s National Nuclear Security Administration (NNSA) announced the achievement of fusion ignition at Lawrence Livermore National Laboratory (LLNL)—a major scientific breakthrough decades in the making that will pave the way for advancements in national defense and the future of clean power. On December 5, a team at LLNL’s National Ignition Facility (NIF) conducted the first controlled fusion experiment in history to reach this milestone, also known as scientific energy breakeven, meaning it produced more energy from fusion than the laser energy used to drive it.
For the first time, researchers produced more energy from fusion, than used to drive it. This promises further discovery in clean power and nuclear weapons stewardship. This historic, first-of-its kind achievement will provide unprecedented capability to support NNSA’s Stockpile Stewardship Program, and will provide invaluable insights into the prospects of clean fusion energy. It would be a game-changer for efforts to achieve President Joe Biden’s goal of a net-zero carbon economy.
TSMC leads
On December 6, TSMC announced that besides TSMC Arizona’s first fab, which is scheduled to begin production of N4 process technology in 2024, it has started construction of a second fab, scheduled to begin production of 3nm process technology in 2026. When complete, TSMC Arizona’s two fabs will manufacture over 600,000 wafers per year, with estimated end-product value of more than US$40 billion.
TSMC is also reportedly in advanced talks for setting up its first potential European plant in Dresden, Germany. The plant could begin construction by 2024. This will be probably signed sometime in 2023.
National Institute of Standards and Technology (NIST) organized a session on US CHIPS and Science Act. Ms. Gina Raimoldo, Secretary of Commerce, USA, said teams are working to ensure implementation and future impact of US Chips Act. USA is also nudging TSMC to do more in the USA.
Dec. 16, TrendForce reported that YMTC may abandon the market for 3D NAND Flash by 2024 following the US Government’s decision to place it on entity list. Well, that may be bad news for China and flash memory market.
That reminds me! I came across a post on LinkedIn, where technologies were being discussed for semiconductors by lots of big names. Ok, my name was not included! 🙂 That’s fine. Here is a list that may be looked up: nanosheets, vertical-transport nanosheet field-effect transistors (VTFETs), compound semiconductor epitaxy, quantum communications, biosensors, glass-based quantum photonic packaging, 3D hybrid electronics, piezo haptics, system-on-multichip (SoMC) architectures, tera-scale-integration, KOOL DRAM, etc. Oh, it was my BDSM moment, surely! 😉
And, that’s it, folks! 🙂 One sincerely wishes that the global semiconductor industry, and semiconductor market, are back to the top again, in 2023. Warm wishes to everyone for a very successful and vibrant 2023.
PS: Edson Arantes do Nascimento, or Pele, Brazil, and football world’s superstar, is no more. Rest in peace, ‘O Rei’, the greatest!
SDN-based middleware for control and management of wireless networks
IEEE 1930.1 is recommended practice for SDN-based middleware for control and management of wireless networks was presented by Dr. Pranav Jha, IIT-Bombay, at the IEEE event.
IEEE 1930.1 is recommended practice for beyond 5G networks. A few issues were there, such as no synergy between RATs, despite usage of common functionality. There is no co-ordination between 3GPP and non-3GPP RATs, fragmented multi-RAT, complex implementation, and poor performance. The existing 5G or mobile network architecture include increased network densification, multi-RAT networks, etc.
Fragmented multi-RAT RAN leads to increased complexity. Dual connectivity is a feature that connects to two base stations. UE’s signalling connection is with a single eNB/gNB. Resources in an individual BS is under control of that BS. Subtle differences in DC mechanism across RATs brings higher complexity. Fragmented RAN makes sub-optimal utilization of resources. 1930.1 unifies multi-RAT RAN via SDN and disaggregation.
SDN is separated into two sets of functions. These are forwarding plane functions and control functions. There is logically centralized control plane, distributed forwarding plane, and standardized interface over forwarding plane. SDN achieves programmable network, standard interface over forwarding plane, controller configures forwarding elements, enables virtualization of forwarding plane, unified global view of the network, and independent evolution of the three planes, and is cost effective.
Secuity is built in, besides interworking with core and optimization. We have the disaggregated data plane for multi-RAT RAN. 1930.1 has modular data plane function, optinization, security, RAN adaptation, and interworking functions. An individual controller can be responsible for controlling subset of modular functions.
SDN middleware and unified control plane are important. SDN middleware is layer between control and data plane. It virtualizes underlying data plane resources, and unifies control and management of multi-RAT RAN. Unified control plane controls user plane functions of all RATs. We have the SDN middleware, multi-RAT SDN controller, orchestration function, and RAN architecture. SDN middleware interfaces are northbound and southbound. There is flexible distribution of functions acrosss SDN middleware. Dual connectivity (DC) can be supported with ease.
You can have network slicing. Every slice is controlled by a different SDN controller. Virtual functions are distributed across different logical networks. 1930.1 has modular data plane functions.
Standard for MAC and PHY for WPANs
IEEE 802.15.4 is the standard for wireless medium access control (MAC) and physical layer (PHY) specifications for low-rate wireless personal area networks (WPANs), was presented by Amarjeet Kumar, founder and CEO, Shrama Technologies. In 2020, we had the inclusion of the all smart utility network related amendments. IEEE 802.15.4 supports 6LoWPAN, 802.15.9 — transport of key management protocol (KMP), IEEE 802.15.10, and RPL. Now, we are thinking of using it for critical infrastructure.
802.15.4 is adopted by Wi-SUN Alliance, and Wi-SUN is used across smart home, smart city, smart grid, and smart home. Wi-SUN Alliance seeks to advance seamless connectivity by promoting IEEE 802.15.4g standard-based interoperability for global regional markets. Other users are Thread, Zigbee, RF4CE, ISA100.11a, and 6LoWPAN. PHY overview looks at FSK, O-QPSK, OFDM, BPSK, etc. Frame formats and PPDU formats are also there. We have added several frequency bands from China, India, Japan, Singapore, Europe, North America and Mexico, Hong Kong, Brazil, Australia, Malaysia, Thailand, Vietnam, etc.
We have low-rate PAN (LR-WPAN). Main objectives include ease of installation, reliable data transfer, etc. 802.15.4 star and peer-to-peer topology networks can be created. PAN coordinator pushes the data back to the cloud. IE variable has also been added to MAC frame controls. There are four types of frames supported — beacon, data, command, and ACK or acknowledgement. Security encryption is done at MAC layer. Different channel access mechanism has been defined. Different modes of CSMA-CA is supported, except Japan.
India has lack of standard for frequency spectrum in 865-867MHz, which is now taken care of. Frequency spectrum is now available in 865-868MHz. Maximum channel spacing alllowed is 200KHz, and maximum transmit power is 500mW.
PRADEEP's TECHPOINTS 