Mentor Graphics Corp. recently announced the Veloce StratoM emulation platform.
The Veloce Strato platform is Mentor’s third generation data-center friendly emulation platform. It is said to be the only emulation platform with full scalability across both software and hardware. Mentor is also launching the Veloce StratoM high-capacity emulator and Veloce Strato OS enterprise-level operating system.
So, how is the Veloce StratoM platform suitable for data centers than previous version?
According to Montu Makadia, one of the worldwide ATM – Emulation experts at Mentor Graphics ; with the Veloce StratoM emulator, there are no major changes to the lab requirements.
There is the same footprint, lower total power consumption, and lower total cooling requirement (air-cooled, air extraction from top). There is an added flexibility on the door and panel (new in Veloce Strato) that makes system maintenance easier.
The Veloce Strato Platform plans for highest effective capacity (up to 15BG) available. Does it really go up to 15BG? If yes, where are the test results?
According to a Mentor Graphics’ spokesman, as of now, no test results are required. Connecting emulators via a sophisticated connection method is common for Veloce. In this case, the Veloce Strato Link can be used to connect multiple Veloce StratoM emulators to reach 15BG capacity.
“We have installations at companies that will not allow us to talk about them by name. These are large, multinational companies with very advanced verification and validation requirements. The installations have gone extremely well and deployment is underway and happening without issue,” the spokesman added.
Mentor is saying there will be a roadmap to 15BG over five years and beyond? What if others come up with a faster system in between?
The spokesperson said: “We can’t predict what other emulation vendors will do in the next five years. We have done our competitive research and believe that we are uniquely positioned to have, both, the largest capacity available in 2021, as well as the emulation platform with the highest RoI.”
Finally, how is the Veloce Strato OS enterprise-level operating system a step above the earlier OS?
The Veloce Strato OS is the centerpiece of the technology for the overall Veloce architecture. The Veloce operating system basically enables three things: The first is the primary core compiler flow. When you use an emulator, you need to compile the design. You synthesize and partition, and move from an RTL/netlist to something that is mapped to the hardware (P&R).
The Veloce Strato OS delivers an integrated, fully automated, single step compilation flow with about 3x faster compilation time and with a 100 percent compile success rate. The compilation time and a 100 percent compile success is one of the key differentiators compared to an FPGA-based emulator.
The OS enables all the use models of verification with a unified compilation, runtime and debug flow. That includes traditional ICE (physical targets-based stimulus), the other virtual use models (SW device models) and testbench acceleration (SW test benches, UVM, SV, SC, TLM, etc.).
The third unique attribute is advanced debug. In addition to the waveform support, it supports Livestream to view a set of important signals, key register for long emulation runs as tests are progressing and Veloce’s unique ‘save and restore’ replay to restore emulation sessions instantaneously at a specified time point for detailed debug activities without re-running the emulation from the beginning.
Here is the concluding part of my discussion with Dr. Walden C. Rhines, chairman and CEO, Mentor Graphics.
Getting billion-gate design correct
In EDA, is there now some chance of getting a billion-gate design correct on first pass?
Dr. Rhines said: “Absolutely! Today’s methodology is up to the task and customers have already reported “billion gate equivalent” designs, i.e., 4 billion transistor, correct on first pass. Correct logic is a much easier challenge than full production readiness on first pass!
“Achieving targeted power dissipation and timing has been more of a challenge but that’s where recent tool improvements are having their greatest impact. Almost all designs of this size now go through exhaustive verification, including power analysis, using emulation. That change in methodology has increased the cycles of verification by more than three orders of magnitude.
“Beyond simply achieving functional silicon with acceptable power and timing, more and more companies are now using EDA tools to assure a rapid ramp to high yield in production. This requires use of a whole new generation of “design for test” tools directed at defect driven yield analysis.
“By our measures, some of the top semiconductor companies analyze more than 500,000 defective parts every day to identify design and process problems.”
Standardization of SoC verification flow
Next, what is the status of the standardization of SoC verification flow today?
He said that Mentor Graphics has long worked on providing leading functional verification products. “We are doubling down on perfecting tools that are part of an enterprise platform where common testbench stimulus, verification IP, and standard verification languages can be used up and down the tool chain. However, the flow belongs to the customer.
“We do not try to enforce a “standard verification flow”. We are happy to accommodate unique customer needs and trust our customer to know the unique requirements of their own markets.
It would be interesting to know what has been happening regarding the coverage and power across all aspects of verification?
According to Dr. Rhines, power management debug has permeated all aspects of traditional HDL based verification. For large SoCs, debugging power-management related problems is a very difficult task. Power is managed wholly or in part by software. Increasingly, validation of power managed designs, including power estimation, requires hardware accelerated solutions such as emulation and prototypes.
New releases of the UPF standard include lots of new capabilities that help verify power usage but that do require additional effort to analyze. Examples include dynamic power related messages, automatic power specific assertion generation and support for the entire flow from simulation through emulation and prototypes.
In addition, lots of designs now use new tools for power management verification, static analysis, rule based power checks and power-aware logic equivalence checking.
Similarly, what is happening in active power management today?
He said that active power management creates the need for functional verification. Traditionally, power has been managed via clock gating, power gating and dynamic voltage and frequency scaling.
The first two methods (clock and power gating) directly impact functionality necessitating the need for things like isolation with clamp values on inputs or outputs to a power gated block of logic, retention registers and gating logic for clocks, as well as the associated control signals or registers and the state machines, which manage the transitions from one state to another.
Verification of the active power management logic and control states necessitates the need for UPF support in verification solutions. The challenge in debugging power management issues drives the value in dynamic checks to ensure valid power down and up sequences, save/restore or resetting/write-before-read behavior of registers in power domains and proper activation and de-activation of isolation logic values.
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It has always been a great pleasure chatting up with Dr. Walden (Wally) C. Rhines, chairman and CEO of Mentor Graphics. It has been a while since we discussed the global semiconductor industry in such detail, and therefore, the latest experience is even more memorable.
First, I asked Dr. Wally Rhines how is Mentor predicting the global semicon industry to perform in 2017?
He said that the growth of the semiconductor market has averaged anywhere between 3-5 percent throughout the 2000’s. In most recent years, since 2008/2009, IC units have grown consistently at a rate of 6-8 percent,, indicating continued demand for semiconductor technology.
ASPs have been drifting downward for a long time with only a handful of exceptions since 1995. The trend appears to be moderating in the last decade, but the downward pressure in pricing has pushed the overall revenue to 3-5 percent growth rate mentioned earlier.
For 2017, most industry research firms and analysts are expecting a relatively positive year (the average forecast across 10 semiconductor research firms is currently at 5.5 percent). Mentor Graphics expects that number to be very conservative due to changing dynamics in the semiconductor industry and how the market is actually measured.
Dr. Rhines said: “Within the last decade there has been an emergence of systems companies designing chips for internal consumption. Those chips are typically not measured at all, or are only partially measured if they are produced by a foundry company. We see the trend in several important areas like smartphone manufacturers.
“Apple and Samsung have been manufacturing their own application processors for some time. However, there is an ever increasing list of other market leaders following with their own designs.
“We are also seeing a number of companies involved with cloud services or other data center intensive companies designing chips for their internal consumption. Unless something unexpected occurs, 2017 should be a good year for the semiconductor industry with growth above average.”
Next, how has been the growth in EDA for 2016? How will the performance be in 2017? Where does Mentor come in all of this?
According to Dr. Rhines, EDA had a strong year in 2016 with total growth of about 9 percent overall, including SIP. Tools alone had growth of about 7.5 percent. Demand for tools continues to look strong for the industry as there remains a strong focus on the leading-edge driving the need for advanced design technology.
Moore’s law continues to drive the industry into smaller nodes as companies are preparing for 10nm, 7nm and 5nm nodes. Advanced nodes continue to drive EDA tool adoption in manufacturing and design.
Additionally, increased challenges and methodologies in functional verification drive technology adoption in enterprise verification including areas like emulation, which had a resurgence in 2016 after several flat years.
Dr. Rhines elaborated: “We are seeing increased activity in areas like ESL as well with ESL Synthesis having its best year ever. PCB design is also enjoying a resurgence in growth as designs become more complex and new design methodologies like System of Systems design begin to emerge.
“In 2016, Mentor Graphics reported an all-time record of $1.285 billion, an 8.6 percent growth or a full point higher than industry tool growth of 7.5 percent. The proposed merger with Siemens should bring additional resources to Mentor’s R&D and customer support capability so our fourth quarter results suggest that customers are pleased with the outlook.”
Part II of this interview appears in April where I will be discussing standardization of SoC verification flow, billion-gate design, power management, etc.
Thanks are due to Raghu Panicker, country sales director, and Veeresh Shetty, marketing manager – Europe and India, Mentor Graphics.
I am really intrigued by this headline! First, SEMI, and now, The Information Network, are making the forecast for China!! However, what has been India doing? Nothing!!
Massive investments in Mainland China are finally showing benefits as the ratio of ICs made in China versus those imported into China increased from 27 percent in 2015 to 29.1 percent in 2016, according to the annual update of The Information Network report entitled “Mainland China’s Semiconductor and Equipment Markets: A Complete Analysis of the Technical, Economic, and Political Issues.” Driving the growth of ICs made in China are a large number of fabs that are in construction and planning production over the next few years, said Robert Castellano, president, The Information Network.
Next, most of the advanced semiconductor packaging is done in China. There are over 150 foreign and domestic packaging companies based in China. Tied to the packaging industry is the need for back-end semiconductor equipment. With its robust IC program, China represents a strong growth area for advanced packages, used to house and protect the ICs. These advanced packages include 3D, TSV (through silicon vias), FOWLP (fan-out wafer level packaging) and flip chip.
According to The Information Network:
* Investments by the Chinese government and foreign semiconductor manufacturers have started having an impact on meeting China’s internal IC semiconductor needs.
* A surge in semiconductor growth in China merely means these same number of chips won’t be made elsewhere — a buying opportunity for semiconductor manufacturer stocks.
* Large equipment companies will benefit from new fabs built but will face increased pricing pressure from new semi manufacturers because their traditional customer base has changed.
* Smaller semiconductor equipment suppliers will benefit from a new customer base that had been traditionally buying from the same vendor.
* Rudolph Technology is an example that benefited last year, positioning itself with its product line and strategic focus on building a sales infrastructure in China.
According to SEMI, USA, China is projected to be the top spending region for fab equipment in 2019 and 2020. Of the 20 more fab projects, SEMI is tracking up to 16 potential 300mm fabs to be constructed or beginning to ramp up throughout the forecast, with the investment targeted for the memory and foundry sectors.
Is India even listening?
Friends, I just learnt that Pradeep’s Point has been selected as the Top Blog for Design and Verification by Bucharest, Romania-based firm AMIQ Consulting. Once again, I am extremely grateful to all of you for helping me achieve this awesome distinction!
This recognition is now my 20th overall, and 16th, including one national recognition, for all of my blogs. That 19 such recognitions are from the overseas, is probably evident of the fact that electronics and semiconductors are well read, followed and even written overseas.
Am I wrong? I sincerely hope not, as there is a lot of work being done in electronics and semiconductors within India. The one thing missing from all of this is the presence of leading Indian firms — origin or based — in electronics and semiconductors. I hope that changes in future. And, till that happens, all of those studies depicting India as an electronics hub, are wasted.
As for the blog awards, I’ve mentioned that it’s my 16th recognition, including one national recognition, for all of my blogs. I have now completed a decade of writing (or blogging), and that’s a great result, won’t you all agree? 🙂 I didn’t even know that the blogs will help me achieve so much international (and national) recognition back in 2007, when I returned to India, from Hong Kong.
I started these blogs, back in 2007, to assist my friends, Kevin Ho Fai Lau, Zoe Lam, Alfred Cheng, Yashan Jo Kuo, John Ng, Claudius Chan, Kittie Wong, Len Sangalang, and some others.
Later, Usha Prasad (who was with me till 2012), S. Uma Mahesh, S. Janakiraman, Anand Anandkumar, Jaswinder Ahuja, Montu Makadia, Veeresh Shetty, Raghu Panicker, Dr Pradip Dutta, Vivek Sharma, Vivek Saxena, Sanjeev Keskar, Sathya Prasad, Dr. Satya Gupta, Rahul Arya, Malcolm Penn, Dr Walden Rhines, Dr Aart de Geus, Shinto Joseph, as well as late Ms Tarana Uthayya, Sanjana Shetty, Varsha Poonacha, Padmini Hegde, my niece, Aanchal Ghatak, my son, Prateek Chakraborty, and several others joined the fray.
A decade of winning awards and titles has been a tremendous journey. Thank you to all of you who have made this possible! 🙂 Thanks are due to my wife, Shima Chakraborty, for putting up with me! 🙂