Industry 4.0

How will 5G satisfy the quintet?

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5G Virtual Expo was held recently. There was a panel discussion on unlocking the potential of 5G. The participants were: Håkon Lønsethagen, Telenor, Research, and 5G Infrastructure Association (IA) member of the Board (EU 5G PPP), Edwin Bussem, Developer Next Generation Infrastructure, KPN, and Ms. Friederike Hoffmann, EVP, Head of Connected Business Solutions, Swisscom. Ms. Julie Snell, Chair, The Scotland 5G Centre, was the moderator.

How are we going to integrate the 5G network into the existing network? Edwin Bussem, KPN, said we are on the verge of being able to provide service levels on wireless connectivity, and there can be a wait-and-see situation with customers. There is a waiting game going on to see who goes first.

Ms. Friederike Hoffmann, Swisscom, added that their issues have not been about integrating with the existing infrastructure. However, some of our antennae have been demolished in Switzerland. Can you imagine that? We are installing a mobile 5G network. We are also working on automated vehicles. The private customer mind is very careful and hesitant in Switzerland. We can’t build the entire network as fast as we want to. We can’t make the networks strong, as needed to be, to fully test the use cases that we need, and to onboard more enterprise customers.

Ms. Julie Snell agreed that people are attacking networks that are not necessarily 5G. There seems to be a real concern that it is not safe enough.

Håkon Lønsethagen, Telenor, noted that in Norway, there have not been that many cases, compared to the UK and Switzerland. We are aware of these things and how we communicate carefully to the public. We are doing this is in a very well-thought way. We are installing and providing services in a secure way. It is also a matter for enterprises and verticals to step up and do testing, along with the operators. They also need to understand the pain points they would like to solve. We are trying to create methodologies to interact with the enterprise vertical customers.

Ms. Snell said there is a trial-and-error method on the move towards establishing standards. Ofcom, UK, released a report that calmed down the situation. Bussem, KPN, said we are trying to project what are the societal benefits that we are going to bring. The public are willing to give it a chance.

Satisfying 5G quintet
Next, there was a point raised about how will 5G satisfy the quintet of trusty, reliability, latency, and bandwidth efficiency.

Håkon Lønsethagen, Telenor, said that they have been able to define some new mechanisms with 5G. Eg., radio channel coding and how we use the spectrum. If you want to aim for high capacity, you typically introduce some buffering and channel coding. That may sacrifice some latency performance. So, there will always be this trade-off. You can probably deploy in private networks with industry use cases. It also enhances mobile broadband. You can also combine this with edge computing. There is 5G and network slicing. It allows you to allocate resources to the demand that you have. You can start optimizing across the whole 5G system. You can also build purpose-built logical networks. Eventually, you can think of green ICT.

Edwin Bussem, KPN, added that there are technology-related benefits with 5G coming into play. It is about optimizing per use case, and per field of interest. We need to provide societal benefits. We are being very careful in what we are promising the market. That’s the sort of prudence you need to take when you consider the quintet.

Ms. Friederike Hoffmann, Swisscom, noted that they have the opportunities to manage the quintet way better than before. Companies don’t stop at national borders. You have production facilities all over the world. We also need standards, and to learn from each other. We usually do this in telco networks and classical partnerships. We need to make sure that when trains are self-driven, they also do not stop at borders. We can do this, and are working on it. There are also gaming opportunities. We can manage resources way better than before, and be more energy efficient. We are going to need close-knit partnerships and ecosystems that are just evolving.

Håkon Lønsethagen, Telenor, said they are migrating to inter-border capability. We are seeing advanced use cases. We still need some time. We need to step up as a community. With 5G, there are use cases that are quite demanding. We also need to develop inter-provider-based services and capabilities.

Ms. Julie Snell said that there is more of a shift toward private networks, eg., in campuses. We need to integrate these private networks to be part of a global network. MNOs are also providing new products and pricing.

Ms. Friederike Hoffmann, Swisscom, said that it is creating a challenge. We did a terrible job at monetizing 4G. When networks are full, we do need the capacity. Do we need more products and pricing? Of course, we do! It also depends on the market segment. There are qualities of service levels that are now possible, that were unseen on 4G. Customers understand there is a big value for them in 5G. They are also making efficiency gains. The use cases of 5G need to be very clear. Customers are also weighing their options carefully, before investing.

Håkon Lønsethagen, Telenor, said there is so much to do in 5G. There are solutions today, and more will happen within the next three years. There will also be society- and citizen-critical services. The application level cannot really express their intent to the network today. We have to work on this. We need to reach the optimization challenges ahead of us.

Edwin Bussem, KPN, agreed, adding that we need to look at what are we handling. You have to treat situations differently, and also have to prepare yourself as an organization. You also have to re-organize your own internal operations. You can charge some price. This is all new to us. We are going to build pricing models on a firm-by-firm basis. We have to take the potential use cases.

Discover, design, and deliver with Emerson: Ms. Vidya Ramnath

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Emerson Users Exchange 2021 was held today. Ms. Vidya Ramnath, President, Emerson Automation Solutions, Middle East and Africa, delivered the keynote. For those interested, I had met up with Ms. Ramnath, while in Singapore at Control Engineering Asia, in 2015. So, it was really nice to reconnect with Emerson.

Ms Ramnath said the MEA region is a fast-growing area for Emerson. Countries are blessed with very good natural resources. There is also a rethink toward future direction. There are three key areas for Emerson: digitalization, diversification, and decarbonization.

Ms. Vidya Ramnath.

Emerson has three goals: discover, design, and deliver. Human progress has been delivered on the bedrock of the ability to discover, design, and deliver. There have been millions of vaccination doses given out this year. Emerson is working with the vaccine manufacturers to speed up their production. We are also helping in the ventilator production and healthcare.

Significant changes happened in 2020. There was oil and gas demand shock. There was also the gain in momentum in environmental, social, and corporate governance (ESG) and sustainability. There were opportunities for diversification.

Emerson’s digital transformation journey began with small investments, RoI-focused initiatives. We offered solutions for asset health monitoring, industrial analytics platform, etc. We have also seen the application of PlantWeb Insight for thousands of assets enterprise deployment with AI/ML. Technology deployment is no longer a problem. It is helping in the customers’ digital future. There is also an emerging need to build a strong industrial backbone.

Emerson is also assessing the ESG and sustainability. We will reduce greenhouse gases by 20 percent by 2028. There is also energy use, supply chain, reliability, etc. Greening by Emerson will see greening through Emerson’s products, expertise, solutions, and services. Greening with Emerson will see engaging the external shareholders by partnering on solution development, etc.

Cyber security key condition for Industry 4.0 adoption

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Thomas Schulz, Channel Manager CEE, GE Digital, presented cyber security as the key condition for Industry 4.0 adoption, on the concluding day of SEMI Technology Week.

With the introduction and integration of Industry 4.0 devices, platforms and frameworks to existing systems comes the issue of interoperability. In industrial environments, securing interconnectivity between diverse devices is often challenging. Difficulties in ensuring security in Industry 4.0 result also from lack of technical capabilities of connected industrial devices and systems, especially considering integration with legacy infrastructures.

Cyber security in manufacturing is very essential. Fast progress is key to enable the valid responses to cyber threats in the future manufacturing environment. Here, the dependence on networks and information systems will increase rapidly. Attacks become smarter, and therefore, they need to be protected against. The semiconductor industry and manufacturing industry can be particularly vulnerable to attacks.

There are technical fields of action for cyber security. There are mobile and intelligent systems, platforms with hosted apps, and factory as an app domain. The physical assets need to be protected. Security by design, and security by default must be guaranteed at the outset.

Industrial automation and control systems, such as SCADA, DCS, ICS, BAS, and PLCs need to be secured. The equipment used in semiconductor manufacturing includes OT, that manages and monitors the industrial process assets, and manufacturing or industrial equipment. Cyber security must protect the automation and control systems to your physical assets and equipment.

There are factors influencing the technical fields of action. The German BSI or Federal Office for Information Security, Platform Industrie 4.0, and associations, such as SEMI are well established. There is compliance with ISO/IEC 2700, IEC 62443, VDI/VDE 2182, and SEMI E169 and SNARF 6506.

The IEC 62443 security for industrial automation and control systems was adopted globally. It created a framework and common language for the end users to communicate their requirements. IEC 62443-2-4 established that manufacturers must demonstrate that security measures are incorporated in their development lifecycles across four key areas: organization, system capability, commissioning and acceptance testing, and maintenance and support.

A penetration test, also known as pen test or ethical hacking, is an authorized, simulated cyber attack on a system that is conducted to assess the security of that system, and identify vulnerabilities. The Achilles test platform is a communications robustness test platform to test and monitor network and operational parameters of devices under real-world conditions. The Achilles Communications Certificate (ACC) verifies the network robustness.

Deep packet inspection (DPI) is used extensively to prevent attacks. DPI systems should always be kept up to date. There is an important role of IDS and IPS in network security. There is also the OpShield from GE Digital to inspect, enforce, and control. You can protect OT networks structurally via virtual segmentation. It creates zones that reduce the mobility and damage of a misconfiguration, or an attacker. The time to act is now!

Holistic data and computing platform for advanced semiconductor manufacturing

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Holistic data and computing platform for advanced semiconductor manufacturing, was presented by Tom Hoogenboom, System Engineer IT, ASML, and BG Lee, Director, ASML, on the concluding day of the SEMI Technology Week.

Holistic lithography is data hungry. Chips are ‘made with data’. The position and shape of every pattern element must be set with sub-nm precision. Holistic lithography is built on data. It helps building the digital platform of the future. We also have the digital platform for patterning.

Holistic lithography is our world. It helps compute the best process and actual process windows. There are compute process corrections. The nm level is fine grained. We have now moved from PCs to central computing platform. Today, we operate the digital twin of a fab. If we go to a new node, we analyze everything that has gone on with the previous, old node.

It is important to note that nm performance can be affected by any small variant on process, equipment, etc. We need a platform for running fab-critical software. There is also the integration of software from other vendors. IT should be ready to integrate.

The key requirement is secure communications. You need to move toward a digital lithography ecosystem based on IT technologies and a single platform.

The IT pieces are there for the next node. Integration remains a challenge. Fab automation has some standards. Digital Twin is needed to calibrate the machines. The ASML digital platform provides integration, and is scalable. You also need to process the equipment and connection data.

Moving to integrated and collaborative smart systems

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John Behnke, GM, FPS Product Line, Inficon, kicked off day 3 of the SEMI Technology Week, that was on the future fab. He spoke about the evolution of smart manufacturing — integrated and collaborative smart systems.

The semiconductor industry has been on the forefront of developing advanced technologies used to fuel innovation and accelerate technology development since its inception. Its understanding and access to advanced technologies, coupled with its need to continuously improve manufacturing efficiency and customer satisfaction has pushed the industry to develop and adopt semiconductor-specific Smart Manufacturing/Industry 4.0 methodologies.

These Smart/I4.0 methodologies are heavily integrated solutions, which enhance the existing systems and capabilities. Data from these multiple systems, such as MES, yield, metrology, fault detection, process control, maintenance, and demand, integrate to create a real-time digital representation of the factory.

Smart manufacturing is based on three pillars. These are sensing, connecting, and predicting. Sensing involves the integrated real-time tool, process, and WIP monitoring. Connecting involves uniting the different and unique data sources. Predicting involves the Digital Twin-enable predictive apps.

Inficon offers FPS Smart solutions, such as Digital Twin, Factory Dashboard, Factory Scheduling, NextMove VTS, and Metrology Sampling Optimizer. Digital Twin enables the integrated apps. It is a never-ending journey of increasing the complexity and adding more information. It is the repository of everything about your digital factory.

The window to the Digital Twin real-time factory visualization is needed. Users are aligned to the immediate fab needs. There are integrated analysis tools, so you can set, track and shift the output goals. You can do historical performance charting, maintenance tracking/planning, and line linearity views. Schedulers pick the best lot for the best tool at the best time, and feed this information to lot delivery systems. This ensures factory-wide performance optimization.

Inficon’s NextMove Vision Tracking System (VTS) tracks the smart WIP movement. Dispatched material needs to be moved as per the schedule. There is integration with FabGuard to allow for SECS equipment set up. He showed some dashboard and scheduling-enabled RoI examples.

5G brings world of new opportunities

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5G MENA Digital Symposium 2021 commenced today. There was a session on secrets to the deployment of nationwide, flexible and robust 5G networks. Masum Mir, VP and GM, Cable and Mobile Business Unit, Cisco, said that 5G brings a world of new opportunities.

There are use cases in connected cars, Industry 4.0, venues, smart cities, smart meters, smart energy, etc. You require redefined security and experience, full-stack automation, and programmable platform.

There are learnings and insights for success. These include coverage planning, distributed architecture, cloud operations, and service transition from 4G to 5G. You need to plan beyond coverage and connectivity, and embrace continuous integration (CI) and continuous development (CD) and skill transformation.

Cisco’s 5G innovation provides simplicity at scale for mobile subscribers, mobile IoT, and nationwide 5G IoT and consumer deployments.

Consumer 5G
There was a panel discussion on consumer 5G: from devices to FWA and beyond. The participants were Patryk Debicki, Field CTO, Guavus, Amar Padmanabhan, Software Engineer, Facebook Connectivity, and Hani Mohammad Yassin, Senior Director/Technology Strategy, Etisalat Group. Gabriel Mohr, Principal, Arthur D. Little, was the moderator.

Amar Padmanabhan, Facebook, said they are working on network-intensive solutions. They are working with Oculus on the AR side. These are technologies that require fundamental shift from 4G devices. A bulk of social interactions are moving to the digital world. Experiences are going to get richer, as we go forward. They will need new network architectures, powered by 5G.

Hani Mohammad Yassin, Etisalat, added that 5G consumer proposition is a challenge. Operators are experimenting how to present 5G to consumer markets. In GCC, we have had success on 4G networks. 5G devices are still expensive. We are offering higher data bundles for 5G. There is also 5G access fee charge from some operators. 5G-specific content will be main driver for consumers.

Patryk Debicki, Guavus, added that gaming devices are expensive today. In 5G, there will be mobile edge computing. That means, gaming devices can become cheaper. Mobile edge compute will need to handle the gaming compute. 3GPP addressed the network analytics function that predicts the consumer’s mobility. It allows preparing content for the customer.

Yassin noted that the younger generation is getting social interactions online. Everything is on demand. Media can be a key monetization lever for 5G.

Debicki added that media is an interesting entity. With 5G, media can be taken to another level. Customers can be provided with specific QoS. 5G allows you to allocate the QoS. It can also analyze the QoS. You can charge only if the level is above a certain value. 5G addresses the access management in a great way. It will allow operators to differentiate on tariffs, depending on consumer behavior. The network becomes an engine for gaming. 5G will be about B2B models.

Padmanabhan said lot of monetization experiences come from sporting events. Delivering critical experiences means network changes in a fundamental way. We need some sort of data localization that is relevant to some campus.

In South Korea, MNOs have actually achieved growth in ARPUs. Yassin said that is a unique experience. The South Koreans have developed certain apps relevant for the local market. They applied those to the devices and networks. An integrated proposition is more suitable in this case. Apps with immersive experience will come over time.

Debicki noted that the variety of 5G devices will play a key role, and whether they support standalone or non-standalone. You need insights of the device capabilities. Yassin said there are lot of questions regarding 4G and 5G. Collaboration is very important among the different partners. We have still not at achieved the full potential of 5G yet. We are only scratching the tip of the iceberg as far as 5G capabilities are concerned.

Debicki said there are lot of metrics regarding smartphones. By 2025, operators will have more consumer IoT devices than smartphones. This is an area that will grow rapidly and overtake smartphones. Padmanabhan agreed there will be heterogeneity. There will be different devices, different access technologies, etc. The platform will need to be cloud-native, etc. There are lot of data center technologies that we are bringing into the open source world.

Siemens FMCS for zero downtimes in semiconductor production

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In order to prevent wafers from defects caused by particles in the air, semiconductors are typically manufactured in a cleanroom environment. The customer needs a facility that is near 100 percent reliable with absolute zero allowance for down time. In this regard, Siemens hosted a webinar on how to achieve zero downtimes in semiconductor production?

Magdi El-Awdan, Senior Manager for Global FMCS Solutions, Digital Industries AG Siemens, first explained FMCS, or facility monitoring and control system. FMCS supports the plant infrastructure and utilities. These include HVAC, ultra pure water (UPW), waste water treatment (WWT), gases and chemicals, low and medium voltage distribution, fire safety and security.

FMCS scope
Customers have essential requirements throughout the industry. Digitalization is now the enabler to optimize production. Siemens supports customers to become future-proof. There are concepts and technology to achieve the next level of productivity. You start with product design, to process and plant design, on to engineering, operation, and services.

There is optimization throughout digitalization. There are integrated engineering information and processes, and the execution of operation and maintenance tasks. FMCS allows optimum efficiency, increased reliability, higher quality, smarter decisions, and greater flexibility in optimization.

FMCS integrates all the disciplines into one central database. Fast and error-free data transfer can be done with the SIMATIC process control system (PCS 7) plant automation accelerator. There is data synchronization, such as control module types, control modules, etc. Siemens also made available the PCS 7 documentation for HVAC with control module types (CMT).

How it works?
Siemens has the central project management and engineering backbone. It helps maintain the same quality. The multi-disciplinary plant engineering from Siemens leads to time saving and quality improvements in projects. There are new ways of co-operation among the customer, process designer, and Siemens.

The customer and Siemens work on the same data. There are services with lifecycle management based on COMOS, the plant engineering software solution from Siemens. Data can be exchanged and updated via the COMOS working layer in pure digital format to avoid any data loss or inconsistency. From an integrated engineering to integrated operation, the result of the engineering is the COMOS Digital Twin.

There are services with the Siemens Lifecycle Management Suite. There is the integration and mapping of system data that enables efficient maintenance functions. Siemens happens to the first DCS company with TUV IEC 62443-4-1 security certificate. Siemens has been supporting customers remotely during the pandemic.

IIoT edge and cloud solution
Siemens also has the MindSphere IoT-operation system for customers. MindApps is the data analytics app. MindSphere is the cloud-based IoT OS connecting OT to the IT environment. MindConnect is the plug-and-play connectivity for the quick connection of Siemens’ assets and open standards (eg. OPC UA) to the other assets. It offers secure and encrypted data communications.

Magdi El-Awdan.

Siemens Mendix is an app development platform bringing cloud to all users. It includes low-code application development environment, app services that make Siemens domain expertise available, and powerful integration capability to connect to any system or data source.

Siemens edge devices can be connected to the FMCS. You can select the information to be shared on the cloud with MindSphere. It makes data interchange very easy. An example is the valve monitoring app. You can increase the plant availability, and reduce maintenance cost through predictive maintenance. You can also increase the transparency on valve and positioner quality, as well.

Examples of AT&S PCB production in China and Osram Opto Semiconductor LED chip fab in Penang, Malaysia, were also presented. FMC enables the same standard everywhere. There is higher plant availability, better data quality, cost reduction, IIoT ecosystem, etc.

Johannes Roeck, Business Developer Electronic Industry, Siemens, was the moderator. Siemens Digital Industries focus is on customer needs with software, automation and services.

Smart manufacturing in More-than-Moore era

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Erik Collart, Edwards, talked about data sharing and the cost of inaction at the Fab Management Forum organized at the SEMI Technology Unites summit. He examined how customers are using data to improve effectiveness of the subfab, reduce the maintenance effort and avoid unplanned downtime.

The key challenge for the subfab and fab include collection. Connection and context are equally important. Machines, processes, data, and people are interacting effectively to reduce risk and uncertainty. Operational excellence is more than collection, connection, and context. He presented a case study solving performance concerns in an OEM R&D environment.

Equipment roadmap
Dr. Mike Rosa, Applied Materials, presented the Technology and Equipment Roadmaps Enabling the More-than-Moore Wave.

Today is the era of Big Data, AI, and IoT. Singular focus on device technology development and customer focus is required. In 2020, the global semiconductor market outlook was $415 billion (down from $471 billion). Smartphone alone represents 25 percent of total spend. The automotive market showed 10 percent growth. Other areas include datacenter/server, industrial, communications infrastructure, and consumer.

Dr, Mike Rosa.

There are emerging device technology apps and on-wafer inflections. There is migration of III-V (SiC, GaN wafer materials), silicon carbide wafer processing for HV MOSFETs, GaN-on-GaN, etc. On the CMOS sensors side, we have novel organic filter materials for high-efficiency photodiodes, etc.

In optical technologies, there are Lidar miniaturization and beam scan, III-V laser diode integration with CMOS, active/passive photonics waveguides, micro LED fabrication and assembly, and quantum efficiency of LED emitter. In MEMS and sensors, there are the monolithic integration of MEMS and CMOS, low temperature and conformal films, ultra-high aspect ratio structures, advanced acoustic piezo materials, and Pb-free materials for piezo actuation. In advanced substrates, there are GaN HEMT, SiC MOSFET, GaAs VCSEL, etc. There are process technology for SiC wafering, advanced implant/EPI for SiC devices. advanced atomic layer etch for GaN, etc.

Applied has a broad range of MtM materials and process technologies. We are making possible the technologies that are shaping the future. Semiconductors and specialty or MtM devices are going to transform the multiple industries.

John Behnke.

John Behnke, GM, FPS Product Line, Inficon, presented on the Evolution of Smart Manufacturing – Integrated and Collaborative Smart Systems. There are three pillars of smart manufacturing — sensing, connecting, and predicting. You need tool state, process state, etc., to arrive at operational efficiency. Digital twin aggregates all the information. There are digital twin-enabled predictive apps, as well.

Inficon offers FPS smart solutions. These include digital twin, factory dashboard, factory scheduling, metrology sampling optimizer, etc. Digital twin is meant for enabling integrated apps. There is the integrated scheduling with the highest RoI app. However, it is harder than most people think. NextMove integrated location tracking or vision tracking system (VTS) is also there. There is also the next-generation metrology sampling optimization. There are dashboard and scheduling-enabled RoI examples, as well.

EU supporting growth of microelectronics

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Day 2 of the SEMI Technology Unites global summit commenced with two sessions, on EU Digital Forum and Advanced Packaging, respectively.

Marco Ceccarelli.

At the EU Digital Forum, Marco Ceccarelli, European Commission, presented an overview of EU policies supporting the growth of microelectronics in Europe. The European Union made a historic agreement, Next Generation EU, to accelerate the recovery of regions and sectors hit by the pandemic, and to increase the resilience of the European economy. The new Multiannual Financial Framework 2021-27 includes initiatives such as the Key Digital Technologies Joint Undertaking and the Digital Europe Program.

EC President, von der Leyen, declared the Europe Digital Decade. AI, Europe’s digital sovereignty, data and infrastructure are the key programs. Digital Europe focuses on capacity and deployment of more mature technologies. IPCEI or Important Projects of Common European Interest, is a program sponsored by member states.

Horizon Europe is yet another platform. 5 mission areas have been identified, each with a dedicated mission board and assembly. The board and assembly help specify, design and implement the specific missions, which will launch under Horizon Europe in 2021. Cluster 4 is on digital industry and space. Related partnerships are for smart networks and services, EuroHPC, photonics, AI, data, and robotics.

Key digital technologies build on ECSEL JU experience and achievements. It also extends scope and includes integrated photonics and higher layers of software. The Digital Europe Programme ensures that Europe drives digital transformation. It will build essential digital capacities, such as HPC, AI, cyber security, and advanced digital skills.

There was also a joint MS declaration on processors and semiconductor technologies. There is a new IPCEI on microelectronics. The IPCEI on microelectronics is divided into 5 technology fields: energy-efficient chips, power semiconductors, sensors, advanced optical equipment and compound materials. An industrial alliance on microelectronics has also been proposed. InvestEU is another program to mobilize private and public investments through an EIB guarantee. Targets include semiconductors, processors, manufacturing ICT components, and AI. There is also the need for skills in microelectronics. Sector Skills Alliance has been co-funded by the Erasmus+ program. The microelectronics METIS project is to develop a skills strategy.

The semiconductor sector is facing exceptional transformations and challenges. New opportunities must arise. The EC underlines the need to join forces for the impactful actions. With committed industrial partners, we can build a platform.

MADEin4 developments
Ilan Englard, Applied Materials Israel, (AMIL) spoke on the MADEin4 Project. There have been metrology advances for digitized ECS (Semiconductor and Automotive) Industry 4.0, at the EU Digital Forum, SEMI Technology Unites global summit. It is Metrology Advances for Digitized Electronic Components and Systems (ECS) Industry 4.0.

MADEin4 is a consortium of 47 partners from 10 countries connecting the full range of the supply chain, from semiconductor equipment manufacturers and system-integrating metrology companies to RTOs and organizations working on key application areas such as the automotive industry.

The MADEin4 Project develops next-generation metrology tools, machine learning methods and applications in support of Industry 4.0 high volume manufacturing in the semiconductor manufacturing industry. He talked about the semiconductor and automotive domains. There are many similarities between them. He added that data is now the new oil, with AI, cyber-physical systems (CPS), digital twins, etc., all coming into play.

Ms. Juliette Vandermeer.

Ms. Juliette Vandermeer, Bruker, presented on Advance X-Ray Metrology Equipment As Part Of A European Semiconductor and Automotive Industry 4.0 Cycle Time and Yield Improvements Scheme, at the EU Digital Forum.

Bruker’s objective in MADEin4 include the development of new x-ray metrology. It has the enhanced total reflection x-ray flourescence (TXRF) spectrometer for automated contamination monitoring/mapping. Yield optimization is the key driver for TXRF. Contamination control is essential. Metal contaminants degrade the silicon device performance in many ways. The TXRF allows the identification of the contamination and its location on the wafer. It covers light (F, Na, Mg, Al), transition, and heavy elements.

Miklos Tallian, Semilab, presented on advanced photo-luminescent metrology equipment. There are challenges with inspection tools, metrology tools, failure analysis tools and lab equipment, etc., at the fabs. There are buried, non-visible electricity active defects, as well. Semilab developed a new technology to detect non-visible electrically active defects in semiconductor manufacturing process to increase the reliability of products.

Dr. Andres Torres, Principal Engineer, Siemens EDA, talked about combining manufacturing data with design for improved process performance. Production data exists in silos, and it is underutilized. MADEin4 brings the relevant data together. There are cross industries manufacturing commonalities between semiconductors and automotives. The manufacturing process flows can be optimized. In semiconductors, the metrology abnormalities can be detected. These defects can also be reduced.

There is virtual testing in automotives. There can also be robot operation modeling in automotive manufacturing. Manufacturing of semiconductors and automotives are automated processes with many opportunities for optimization.

Bernard Pelissier, Maxime Besacier, and Jean Herve Tortai, LTM-CNRS, and Ms. Delphine Le Cunf, STMicroelectronics, presented on new industry 4.0 metrology approaches driven by predictive in line control requirements at the EU Digital Forum.

Ms. Delphine Le Cunf, STM, said advanced technology nodes are the technology drivers. The key enabler is to increase productivity. Next, LTM uses the unique metrology toolset based on versatile and hybrid lab techniques implemented on the 300mm platform. LTM actions in MADEin4 are in line with Booster 1 and Booster 2. Maxime Besacier, LTM talked about artificial neural networks (NN) for dimensional metrology. The goal was to improve the robustness of the results, and reduce the measurement uncertainties.

Semiconductors catalyst for resiliency and sustainability

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At the ongoing Technology Unites global summit organized by SEMI, Ms. Sabine Herlitschka, CEO, Infineon Technologies Austria, presented on Technology with a purpose. We cannot direct the wind, but we can adjust the sails. We need to take advantage of the similar situation provided by the pandemic.

We can accelerate digital transformation. Semiconductors is now the catalyst for resiliency and sustainability, and new developments, Covid-19 has accelerated digitalization by several years. Funding for digital initiatives increased significantly. Covid-19 also created a sense of urgency within organizations.

Ms. Sabine Herlitschka.

Semiconductor has been presented with several new opportunities post the pandemic. There have been global investments in semiconductor industry. Infineon is investing $1.6 billion in Austria. Globalization and data flow have heralded a new era. The ‘data giants’ are becoming clear economic factors. The data industry is now shaping markets. It is having significant impact in deciding conditions.

ICT is the key enabler of green growth in all sectors of the economy. Government action plans to battle climate change. Trends toward electrification of cars remains unchanged, driven by more stringent legal guidelines. Smart control also enables substantial energy efficiency. Energy efficiency is huge for the energy demand. Infineon had decided to be climate neutral by 2030. It has set milestones.

Lastly, semiconductors also enable societal sustainability. We need to focus on skills and qualifications. It is time to think big and act bold.

Advent of future
Next, Axel Fischer, Samsung Semiconductor Europe, presented on The Advent of the Future. The fourth industrial revolution or Industry 4.0 is already here. The foundry market has been growing, focusing in 5G, HPC, and AI. Data connection and processing apps are driving market growth.

Innovation maximizes the benefit of node transition in semiconductors. We have improved with validated process modules, and reuse design infrastructure, including IPs. The continuous improvement of technologies has led over time to PPA improvement. He gave an example is the ARM CPU experiment.

Samsung foundry has solutions for all the needs. It offers complete solution for HPC and AI. This includes advanced process technology, advanced packaging, and advanced IPs. Samsung Advanced Foundry Ecosystem (SAFE) is also growing. For instance, the SAFE OSAT has 9 partners and 16 package platforms.

Samsung Foundry has strong expansion to the HPC segment. It is ramping third EUV node to HVM. It also has a breadth of process, IP, and packaging technologies. By 2030, there will be a true general foundry, with AI/ML, DCs, automotive, mobile, consumer and C/GPU segments.