SEMI Europe

Diversity and inclusion in semiconductor industry

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There was a session on diversity and inclusion in semiconductor R&D at the Connecting Heterogenous Systems summit organized by SEMI Europe. Ms. Cassandra Melvin, SEMI Europe, introduced the diversity roadmap. It includes campaigns to promote best and next practices, diversity council, and talks at Semicon Europa. SEMI will also award the industry leader for diversity and inclusion in 2022.

Ms. Beate Burkhart.

Ms. Beate Burkhart, Head of Materials Innovation Pipeline, Semiconductor Solutions, Merck, presented on diversity and inclusion in semiconductor R&D.

Every day, Merck’s nearly 58,000 employees work in 66 countries to make a positive difference to millions of people’s lives by creating more joyful and sustainable ways to live. Diversity is talked about much more today. Today, 67 percent job seekers say that a diverse workforce is important to them when considering a company’s offer for employment, according to Glassdoor. Further, 57 percent of existing employees want their companies to do more to increase workforce diversity.

77 percent of the semiconductor leaders think that we have talent shortage now! R&D investment is the top priority of most companies. There are 25 percent females in semiconductor industry! Attracting women in STEM and young generation are hot topics. Finally, 54 percent APAC talents prefer local Asian companies.

Merck is driving D&I Initiatives as a top priority. Diversity is a clear business need for Merck. Merck is driving many corporate initiatives, but ultimately, diversity in teams can only grow when everyone accepts their responsibility to keep unconscious bias in mind when hiring and developing team members, and challenge themselves to think outside the box. Merck has a Material Innovation Pipeline (MIP) leadership team. MIP is a diverse organization working in a multi-cultural environment.

There is room for improvement. We can increase the share of women. We can increase diversity. We can increase share of colleagues with Asian origin in the global semiconductor solutions R&D leadership and extend the team. Merck is driving D&I initiatives as a top priority. Diversity is a clear business need for Merck. We are all responsible for tackling it.

Ms. Christine Pelissier.

CEO-level priority
Ms. Christine Pelissier, BLM SEMI Europe, Edwards, presented on Knowledge + Action = Change. Today, diversity and inclusion is a CEO-level priority and considered important throughout all levels of management. Work-life balance, family, and individual wellness are part of total employee experience. Companies measure inclusion, diversity, and lack of bias in all recruitment processes, promotion, pay, and other talent practices. Leaders are promoted on their ability to lead inclusively.

Diversity and inclusion goes beyond education to focus on debiasing business processes, and holding leaders accountable for inclusive behavior. Companies hold managers accountable for creating an inclusive culture, using metrics to compare them against each other.

There is the ADKAR change management model for D&I. These are awareness, desire, knowledge, ability, and re-inforcement. At Edwards, new D&I goals and action plan was agreed. In 2021, inclusion works was launched, first employee resource group created, mitigating bias training launched, best practices guide launched, inclusive language steering group started, inclusive leaders development for senior leadershio team created, wellbeing strategy launched, and new D&I questions introduced.

Edwards’ D&I goals are to achieve year-to-year increase in the percentage of women, and to achieve 30 percent representation by 2030. To increase visibility, awareness, and understanding of diversity. To foster an inclusive culture across Edwards with employee awareness and contribution. Finally, to understand and minimize the potential bias in people processes. She presented five case studies across inclusion, education, leadership, bias, and language.

Ms. Mor Azarya.

More women to work in high-tech
Ms. Mor Azarya, Senior Director, R&D Central Engineering, EPC, KLA, presented on building a foundational employee resource group (ERG) for supporting and promoting women in a global semiconductor equipment company.

KLA is in semiconductor process control. Systems find defects and variations that affect chip performance. There was the establishment of EPC – Electronics, Packaging, and Components group.

It’s still the standard to be the only woman in the room. Its still standard to get management comments. The environment still apply the pressure. We need more women graduates in STEM, more women to work in high-tech, more companies need to encourage awareness.

KLA established the WISE ERG in 2018. Diversity employee resource groups are encouraged by HR, and established and managed by employees. The USA team was set up in 2018, followed by Israel in 2019, India in 2020, and Belgium and the UK in 2021. WISE is women in STEM empowered.

WISE goal is to empower women in semiconductors. We need to increase the percentage of women CV for open positions. We also increased percentage of women in key positions. We are contributing to increase the percentage of women in STEM. We are gradually making the change through awareness and actions.

Metrology advances for digitized ECS Industry 4.0

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Day 2 of the Connecting Heterogenous Systems summit organized by SEMI Europe began with a session on metrology advances for the digitized ECS Industry 4.0: Digitization of manufacturing for enhanced productivity.

Addressing the challenges of Industry 4.0 was presented by Yoav Hirsch, Project Manager CIS R&D, Tower Semiconductor. It has high quality and flexibility of worldwide manufacturing capabilities. TowerJazz announced a new brand identity in 2020. Tower is the analog foundry for automotive. It offers analog technologies for connected automated vehicles.

Yoav Hirsch.

There are challenges of ML. Partial Industry 4.0 challenges include smart sensors that are fast with high resolution, data transfer with bandwidth and smart algorithms, and information. We have tons of data. But, how much of that can be converted to useful information? We can transfer the useful information outside.

Industry 4.0 and semiconductor market trends are aligned with Tower’s revenue. This includes wireless everything (36 percent), green everything (32 percent), and smart everything (18 percent), respectively. There is a movement to make sensors smarter. There is the Industry 4.0 and zero-defect initiative in the semiconductor industry. Quality is achieved via design and development, wafer manufacturing, and continuous improvement. Products continue to move up via integration.

Tower has done innovations in image sensors. It has developed global shutter industrial image sensor, low-cost SWIR (short-wave infrared) imager, and 3D imaging using time-of-flight (i-ToF/d-ToF). There are new, emerging high growth markets. These include under screen fingerprint and time-of-flight. ToF sensing is used for face recognition, fast camera auto-focus (smartphones), gaming, AR commerce, etc.

Tower is also developing displays for cyber-physical systems. It is working on uLED screens. Silicon substrates have greater thermal conductivity than sapphire, allowing microLEDs to be driven harder before output becomes thermally limited. It has also developed uOLED monolithic displays for AR/VR apps.

Industry 4.0 driven by automotive and handled devices push the boundaries of semiconductor manufacturing for beyond state-of-the-art cyber-physical devices. While global shutter, high resolution industrial imagers are still in high demand, 3D imaging with i-ToF or d-ToF technologies is at the heart of R&D. It is too soon to agree that microLEDs will overtake OLEDs. Increased demand for quality is derived from semiconductor advancement, increased demand for image sensors, environmental approach and capacity shortage.

Sensing and computing for AR/VR: Facebook

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Ms. Barbara De Salvo, Silicon Strategist and Reseach Director, Facebook Reality Labs, presented the sensing and computing technologies for AR/VR, at the SEMI Europe Connecting Heterogenous Systems summit.

Today, Facebook is using AR/VR Aria glasses, having introduced Oculus Quest and Oculus Quest 2 earlier. It can enhance memory and cognition super powers. We can share whiteboard with colleagues in complete privacy. AR/VR market forecast is 53 million units by 2025, with total market CAGR at 54.1 percent, as per IDC. Core sensing and tracking functions are given great attention. She showed a sensor use case SLAM or simultaneous localization and mapping, and for eye tracking. Sensor and camera requirements include global shutter sensors for computer vision apps, low-light sensitivity, small form factor, etc.

Ms. Barbara De Salvo.

There is the digital pixel sensor with ultra-wide dynamic range. In DPS, each pixel contains an ADC and digital memory. Pixel data is stored in digital memory and readout as digital bits. Two silicon wafers are bonded face-to-face. BSI PD and front-end sensing circuits are on top layer, and ADC and memory are on bottom layer. Small pixel is enabled, and there is lower supply voltage on ADC layer.

There is the triple quantization scheme. There are three ADC modes, in low-, mid-, and high-light pixel. Each pixel automatically selects own optimal mode for own light level. She introduced the distributed sensing and compute architecture.

Frank van de Scheur, Philips, presented a talk on MEMS, micronano technology, and sensors for healthcare at the SEMI Europe Connecting Heterogenous Systems summit. He said these are vital for the future of healthcare. Novel MEMS technologies such as CMUT open new window for wide spectrum of diagnostics and monitoring solutions in healthcare. Co-operation and partnerships are required to create platforms and achieve standardization.

How future is heterogenous?
Mark Gerber, Senior Director Engineering, Marketing & Technical Promotion, ASE, presented on how the future is heterogenous. We live in an age of digital transformation and data centric. Worldwide data is likely to grow to 175ZB by 2025, as per IDC. Key growth drivers in semiconductors include 5G, HPC, AI, IoT, and automotive. All of these require innovative IC design, advanced wafer fabrication, diverse packaging, comprehensive product and testing.

Mark Gerber.

Advanced packaging extends the Moore’s Law. Die costs continue to rise. There is chip and system integration convergence. They are converging to heterogenous integration (HI). Integration opportunities extend from the edge to the cloud. HI is the integration of separately manufactured components into higher-level assembly (SiP), and provides enhanced function and improved operating characteristics.

Key HI drivers include chiplets (high end), homogenous yield improvement, Si node optimization, and Si node development cost. ASE offers range of silicon integration solutions. ASE’s range packaging technology and capabilities includes, from SoC integration (FC) to system-level heterogenous integration (2.5D, fanout FOCoS, SIP), and from Si chip integration, power integration, to optical integration.

Looking towards 2022 and beyond, collaboration is more important. We have a critical role to play in the data-centric era. Packaging technology innovations are game changing. The future is heterogenous integration.

SEMI Europe organizes connecting heterogenous systems summit

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SEMI Europe recently organized the Connecting Heterogenous Systems summit. The event comprised two tracks — 3D and Systems, and MEMS and Imaging.

Power delivery for heterogeneous systems
Kaladhar Radhakrishnan, Intel Fellow, presented the opening keynote on power delivery for heterogeneous systems. There are semiconductor trends, such as transistor count, frequency, single-thread performance, and core count over 50 years. There is a straight line for transistor count, which shows that Moore’s Law is alive and well. In frequency, it is not a straight line. However, single-thread performance has been better, with a straight line slightly curving.

Kaladhar Radhakrishnan.

The big change is with core counts. It has risen from 2005 onward to 2020. Post-Dennard scaling has seen improvements in transistor material and structural innovations. FinFETs introduced a decade ago have seen significant shift in transistor performance. There is area scaling at the cell level. Additional area scaling was achieved through cell improvements, such as isolation using single dummy gate and COAG (contact over active gate).

We are at an inflection point with monolithic scaling challenges. We are moving to tile-based SoP. Yield is good, and each IP is on an optimized node. The overall cost is also lower. Intel has been developing advanced packaging portfolio, such as the EMIB and Foveros. It also unveiled the Foveros Omni And Foveros Direct, to be available from 2023 onward. Intel is also shipping heterogenous systems, such as Agilex FPGA, and Ponte Vecchio Xe HPC.

Power scaling trends
Power scaling trends are evolving. We are seeing a shift in thermal design power for high power GPUs and CPUs. Growth will only continue, at least in the data center side. Voltage domain scaling has seen shifts in client and server power rails, till 2021. It will continue to grow. Reliance on integrated voltage regulators will also be there.

The next stop will be LDO regulators. Buck regulator will be the most versatile. However, it is harder to implement on dies and is more expensive. We can look at the impact of routing losses vs. output power. As the output power goes up, some form of integrated voltage regulation is required to bring in power at higher voltage and keep routing losses manageable. An IVR technology is the CoaxMIL inductor. Another is the SuperMIM capacitor. There are switching FETs, as well. Intel is introducing power via technology. There are back side interconnects for power routing and front side interconnects for signal routing.

Heterogenous integration is one of the key vectors in extending Moore’s Law as monolithic scaling slows down. It is developing robust portfolio of advanced packaging technologies for future systems. Proliferation of voltage domains and power scaling are driving IVR in heterogenous systems. Intel is developing the building block technologies to enable efficient power delivery to high-power heterogenous systems.