Cockpit of future more versatile and connected: Continental

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Every new year comes with the footnote: what’s going to be the driver for an industry? Alright, let’s start with driving, or, shall we say, automobiles!

Continental AG is a German automotive manufacturing company. It specializes in brake systems, interior electronics, automotive safety, powertrain and chassis components, tachographs, tires, and other parts for the automotive and transportation industries.

Automated driving, anyone?
So, how is the situation with automated driving today? Has it, at least, passed the safety tests? Alexander Klotz, Head, Continental’s Technical Center, India, said that while fully automated driving (AD) is still far, Advanced Driver Assistance Systems (ADAS) is enabling the possibility towards AD. It is gaining popularity among the end consumers and developers. Safety becomes a crucial parameter when lives are involved.

Alexander Klotz

“We cannot have a system that is 99 percent safe. We need systems that are 100 percent reliable. When it comes to automated driving, improvement in radars, Lidars, camera technologies, ABS and ESC, redundant braking systems are helping in creating safer systems. We have various passive safety modules that ensure an additional layer of safety. Safety tests from automation levels 3 to 5 are already undergoing, and the results are very promising.”

Cockpit of future
How will the car’s cockpit of the future look like? Which functions will be available?

According to him, the three — ‘Automated, Connected, Electrified and Shared’ technologies, are shaping the future of mobility. They are transforming the traditional cockpit into holistic human-machine interfaces that cater to the driver and passenger by providing driver information and entertainment. The cockpit of the future will be more versatile and connected with the surrounding environment to provide both the driver and passengers a completely different experience in terms of personalization and safety.

The general industrial consensus is that the cockpit of the future will most likely consist of an Integrated Interior Platform (IIP) – a human-machine interface that combines various displays, such as glass surfaces with a head-up display (HUD) and central console cross-domain units etc.

The displays interact with hand-motion gestures and IIP can easily learn how the driver feels and wants. And, if the vehicle is fully automated, the driver can sit back and relax, as the whole cockpit could be transformed into an entertainment center. The possibilities are infinite.

What about haptics, LiDAR?
Let us look at the new haptic elements being introduced. Also, we need to see the direction being taken by LiDAR (light detection and ranging).

He said: “We are continuously working on haptic control elements, such as touchpads, control panels, including overhead control panels for the intuitive operation of various functions. We fit haptic control elements with additional components and functions, including active haptic feedback, display modules, proximity detection and near-field gestures.”

Next, has Continental been able to make LiDAR work? Klotz noted: “We started working on LiDAR about a year ago in Bangalore. Now, we have a large team of engineers working on the technology. To give an overview, the signals from LiDAR help in object detection and classification. The signals help in building safer systems by being able to recognize different objects, pedestrians, lanes etc., on the road. This becomes critical when we talk about ADAS or automated driving.”

The LiDARs give good depth perception and helps in accurate classification of objects. LiDAR emits rapid laser signals which bounce back and measure the distance between the objects and vehicles. This data is fed into Continental’s robust algorithms that are used to detect pedestrians, cyclists, lanes etc. This data is then validated by our teams and checked for reliability.

Focus on advanced platforms
Further, how are advanced platforms continue to breakthrough into automotive? Which platforms, and why?

He added that globally, as well as in India, the automotive industry is undergoing a major transformation. The focus towards electrification, safety, clean mobility, connected mobility, etc., has driven new technologies across the industry.

“We, at Continental, have always worked on technologies for the future, among which, a few breakthrough technologies have been introduced in the market in 2019.

“In the year 2019, we saw an increased demand in ABS and airbags. The next level in the braking system technology will be ESC and Autonomous Emergency Brakes (AEB). ESC further enhances vehicle safety and provides increased comfort to the driver. ESC is a prerequisite for further safety technologies like Advanced Driver Assistance Systems (ADAS).

“Another technology is Integrated Interior Platform (IIP). The IIP combines various displays, such as glass surfaces with a head-up display (HUD) and central console cross-domain units, which shows all the actions and functions that both the driver and the vehicle can perform. The displays interact with hand-motion gestures to enable maps or other elements to be shown.”

Information is rapidly collected from various sources and later presented in an easy-to-read way that always keeps into account both the state of driving and drivers. Moreover, information can be re-arranged to be shown on the selected display and interacted with using only one device. IIPs are transforming cockpits across the globe completely.

The Occupants Safety Monitoring technology (OcSM) is an innovative solution that enhances vehicle’s passive safety system. OcSM monitors the environment with the help of combination of sensors such as camera, data from seat sensors etc. This creates a complex sensor fusion model, through which optimum deployment strategies for the restraint systems are spontaneously calculated for each occupant.

For instance, the deployment of airbags can be timed by reading the driver and passenger positioning and optimize its protective effect. In an automated driving situation, the driver will essentially move from focusing on road to something else, here is where OcSM will have vital role to play by ensuring optimum restraint safety, based on cabin situation.

Changes in 2020
Finally, what are the changes likely in cars and commercial vehicles in 2020?

According to Klotz, the major trends that will characterize the automotive sector in 2020 would be vehicle safety, electrification and connectivity.

“A greater use of electric vehicles is, for sure, the main trend we can expect in the coming year. The automotive sector will see an increased interest in electrification strategies with new and improved hybrid and electric vehicles.

“Connectivity between vehicles is also expected to grow significantly. Vehicles will start to feature Wi-Fi and connectivity tools allowing it to communicate with nearby vehicles and the environment.

Further, new functions, such as HMI, will gain popularity in the cockpit of the future. These will allow better collection and display of data for a better driving experience and driver satisfaction. While the safety technologies will continue to gain much needed attention with technologies such as ESC, the AEB and the other ADAS products will tend to become more of a standard feature in most of the medium segment cars.

Trends that shook the world 2010-2019!

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You’re a good soldier, choosing your battles
Pick yourself up and dust yourself off and back in the saddle
You’re on the front line, everyone’s watching
You know it’s serious we’re getting closer, this isn’t over
The pressure is on, you feel it, but you’ve got it all, believe it
When you fall get up oh oh, and if you fall get up oh oh
Tsamina mina zangalewa, ’cause this is Africa
Tsamina mina eh eh, Waka waka eh eh
Tsamina mina zangalewa, this time for Africa! 😉
By Shakira, from World Cup Soccer, 2010! 😉

We have come to the end of a very interesting decade! While it was not so engrossing as the 2000s, there were several developments worth noting. But first, let me take you all back to March 15, 2016!

Around 2.30am, I was in the bathroom. All of a sudden, my legs simply gave way! I didn’t know what was happening to me. Also, there was a sudden increase of chest pain! I clung on to the bathroom door, and somehow crawled to my bedroom. There, I tried to wake up my wife! By the time she was up, I was lying down on the floor, sweating heavily, and blacking out! Mind you, I never drink!

My wife and brother rushed me to Sodhi Nursing Home, where the doctor diagnosed me with a severe heart attack. He recommended that I be immediately taken to Action Balaji Hospital. There, the doctors took one look at me, and rushed me to the operation theater. I was later told that I had a massive heart attack, with 99 percent blockage in my veins. I don’t even know what the doctors did, but here, I am before you, presenting my state! This is a trend, I never even imagined, would happen to me!

Given here are some of the global technology trends and happenings that shook the world during the last decade:

Mobile Internet, Bluetooth and Wi-Fi
Back in late 2000, at the ITU World Telecom event in Hong Kong, the first mobile phones with Internet browsing were being touted. Back then, mobile Internet was all the rage! As, were 3G and Bluetooth! This was the 3G technology based on W-CDMA and also, TD-SCDMA. Those were also the days when ‘WAP is CRAP’ made more headlines, and bore the brunt of many ‘telecom jokes’! Today, we can’t even imagine a life without the mobile Internet! And, we are greatly bothered if we can’t access a page on our mobiles!!

In early 2002, I wrote an article for Electronics Business News Asia (EBN Asia), Singapore, on Bluetooth, which was still trying to find its bearings. I can’t locate that article anymore! Some of the comments are worth remembering. One comment was whether Bluetooth and Wi-Fi could co-exist! Today, the world is into launching Wi-Fi 6 and Bluetooth 5.1!

March 2011, we saw the Japanese earthquake – The Japanese earthquake and tsunami stunned the global electronics and semiconductor industries!

Tsunami and earthquake
The preliminary assessment of Texas Instruments’ manufacturing sites in Japan revealed that the fab in Miho suffered substantial damage during the earthquake. Teams are working to reinstate production in stages, reaching full production in mid-July. TI’s fab in Aizu-Wakamatsu was damaged, but was being re-started with full production estimated by mid-April. TI’s third fab in Hiji was undamaged and running at normal capacity.

Sony Group Operations were said to have been affected by the Pacific coast of Tohoku earthquake, tsunami and related power outages. For Elpida, the Hiroshima Plant suffered little impact as it is located in Hiroshima in the southwest of Japan, However, the Akita Elpida memory plant is not in operation as of the time of the announcement due to power shut down caused by the earthquake, and it is hoped that normal business will resume when the power returns.

Tsunami hits Japan!

Iwate Toshiba Electronics did not report any casualties, but as of March 15, there was power lost, with limited partial recovery to start from March 13. As of March 15, 12:00pm, seven factories out of 22 of the Renesas Group’s factories in Japan temporarily shut down production.

The Shin-Etsu group reported that as of 1pm, March 15 (Japan Time), necessary inspections were carried out at Shin-Etsu Chemical Kashima Plant (Kamisu, Ibaraki Prefecture) and Shin-Etsu Handotai Shirakawa Plant (Nishigo Village, Fukushima Prefecture), both of which were out of operations.

Mitsui Chemicals Group reported the effects of the Kanto-Tohoku earthquake on its operations. The operations at the Kashima Works (Kamisu City, Ibaraki Prefecture), was suspended since the earthquake. Operations were resumed after assessment of damage by the earthquake and tsunami.

At its Ichihara Works (Ichihara, Chiba Prefecture), production at the ethylene plants was according to schedule. The operations at Mitsui DuPont Polychemicals and Chiba Phenol plants were suspended since the earthquake.

At the Mobara Branch Factory (Mobara City, Chiba Prefecture), operations at acrylamide and paint toner binder resin plants have been suspended since the earthquake. After assessing effect of scheduled “rolling” blackout, operations were resumed.

USB 3.0 also became widely available, while 22nm chips entered mass production. Consumer-level robotics were also booming.

Birth of EVA
In May 2011, the Embedded Vision Alliance was born! Over 15 leading technology companies, came together in Oakland, USA, to ‘speed up the adoption of computer vision capabilities in electronic products.’ BDTI, Xilinx, and IMS Research initiated the EVA, and were joined by Analog Devices, Apical, Avnet Electronics, CEVA, CogniVue, Freescale, NVIDIA, National Instruments, Texas Instruments, Tokyo Electron Device, MathWorks, Ximea, and XMOS as the founding members.

Still in June 2011, June 8 happened to be World IPv6 Day. Google, Facebook, Yahoo!, Akamai and Limelight Networks were among some of the major global organizations offering content over IPv6 networks on a 24-hour test flight! World IPv6 Day’s goal is to motivate organizations — ISPs, hardware vendors, OS vendors, web companies, etc., to prepare their services for IPv6, as IPv4 addresses ran out! IPv6 was designed to succeed the IPv4.

End of Harry Potter, Steve Jobs
In July 2011, we saw the end of the spectacular Harry Potter movies! Right from the time Harry confronts Helena Ravenclaw or the ‘Grey Lady’, the Death Eaters attacking Hogwarts, the very brave resistance put up by the school inhabitants, led by Prof. Minerva McGonagall, the tragic death of Severus Snape at the hands of Voldemort and his pet snake, Nagini, and Snape’s final meeting with Harry, following which, Harry views Snape’s pensieve and learns about his love for Lily Potter, up to the time Harry enters the Forbidden Forest to meet his death! Or, was it Harry, or Voldemort, who dies? It’s all breath-taking!

October 2011, Steve Jobs, the master of the game, is gone! I first had a look at the Apple Mac, while at SBP Consultants & Engineers, back in 1988. I was surprised to find a computer that could do desktop publishing so well! By then, Jobs had gone out of Apple, fired by John Sculley, then Apple’s CEO, sometime in 1985. Jobs returned to Apple in 1996, a time when he had floated PIXAR and NeXT — the company Apple eventually bought, and returned Jobs to Apple. The rest is history!

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Predictions 2020 on Raspberry Pi, SDP and cloud-based DR

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DH2i’s CEO and co-founder, Don Boxley, foresees two key developments in 2020, regarding Raspberry Pi, software-defined perimeters and cloud-based DR. These are as follows:

  • Enterprises will combine Raspberry Pi (RasPi) and software-defined perimeters (SDP) to create secure low-cost IoT networks

All over the world, people are using Raspberry Pis (RasPi) to learn about and build Internet of Things (IoT) devices. Raspberry Pi is a great platform for IoT – its a very cheap computer that runs Linux and provides a set of open GPIO (general purpose input/output) pins that allow you to control electronic components.

Don Boxley

Software-defined perimeter (SDP) software improves the security of data flows between devices by removing an IoT device’s network presence, eliminating any potential attack surfaces created by using a traditional virtual private network (VPN). In 2020, enterprises will take advantage of the ubiquity of RasPi and the security of SDP software to enhance product differentiation with high-value IoT networks.

  • Smart endpoints and software-defined perimeters (SDP) will transform cloud-based disaster recovery (DR)

Many organizations are pursuing a cloud-based disaster recovery (DR) strategy to achieve the business objectives of:

  1. Getting replicas off-site, and
  2. Eliminating the cost and complexity of building and maintaining a DR site.

But, these DR strategies typically depend on a VPN to connect the on-premises source to the cloud-based target. That’s a problem, because traditional VPN software solutions are obsolete for the new IT reality of hybrid and multi-cloud. They weren’t designed for them. They’re complex to configure, and they expose “slices of the network,” creating a lateral network attack surface.

In 2020, a new class of DR software with integrated SDP security will emerge to eliminate these issues and disrupt the cloud DR market. This new SDP-enhanced DR software will enable organizations to build smart endpoint DR environments that can seamlessly span on-premises and the cloud without the added costs and complexities of a VPN, and with virtually no attack surface.

My thanks to good friend, Ms Nicole Gorman, DH2i, USA.

Global semiconductor market likely to grow 6 percent in 2020!

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Given the depressing run, so far, in 2019, how is the global semiconductor industry going to perform in 2020? The mid-year global semiconductor sales was down 14.5 percent, compared to 2018, as per the Semiconductor Industry Association (SIA).

Recently, SIA reported that the global semiconductor sales had increased 3.4 percent month-to-month in September 2019. Q3 sales were 8.2 percent higher than Q2, but 14.6 percent less than Q3 of 2018. Are there any hopes for a better 2020? Let’s find out!

I asked Len Jelinek, senior director, Semiconductor Manufacturing at IHS Markit, the key question regarding the global semiconductor industry’s performance in 2020.

Hold it, recovery in sight!
Indeed, there are hopes! Len Jelinek said, “In 2020, IHS Markit now anticipates that the market will rebound slightly and achieve a 6% YoY revenue growth.” Now, that’s excellent news for everyone in the global semiconductor industry!

Regarding the noticeable trends next year, he added that the market in 2020 will be driven by two significant factors. One, the return to growth for global server expansion, and two, the introduction of 5G handsets.

“The first factor will drive stabilization in memory pricing, while the second factor is very likely to drive TSMC’s revenue for advanced component manufacturing to record levels. As next-generation handsets become available and at lower prices, the consumer is very likely to transition very quickly to the next generation of technology.”

Automotives key?
How is automotive going to be a significant application in future? What other segments are likely to grow?

Jelinek said: “Any automotive discussion needs to start with the fact that the automotive semiconductor represent approximately 10-12 percent of the total chip market. As the automotive industry recovers from the disastrous year in 2019, the trends in the industry will be for smarter, safer and more ecologically friendly cars. These consumer-driven demands will help to drive component suppliers in power, discrete and analog.

“Beyond automotive, the wireless and the server markets are expecting to see modest growth in the industrial market segment. Security, medical and other markets are forecast to rebound.”

As for the emerging new opportunities in automotive, IoT, AI and AR/VR, he added: “In automotive, the most exciting new technology is the silicon carbide (SiC) used in high-voltage applications targeting HEVs. In AI and AR/VR, it’s all about the enablement of development through advances in chip technology.”

As per Rohm, SiC is emerging as the most viable candidate for a next-generation, low-loss semiconductor element due to its low ON resistance and superior high temperature, high frequency, and high voltage performance as compared to silicon.

What about foundries?
Foundries are said to be performing a bit below par. Are they? Let’s see how are China and Taiwan are driving the growth of foundry services.

He replied: “TSMC is the dominant pure-play foundry company. With its leadership position in advanced manufacturing, including next-generation packaging, no other foundry is likely going to challenge TSMC in 2020.

“In China, growth of the domestic foundries is being supported by the government initiatives for ‘Made in China.’ More specifically, China wants to guarantee the availability of semiconductors. Although the Chinese foundries are behind the Taiwanese foundries, they are rapidly closing the technology gap.”

Miniaturization of electronic components
Another trend has been the rising demand for miniaturization of electronic components.

He added: “If you are meaning advanced packaging (heterogeneous packaging or chiplets), advances here will allow designers to bring together dissimilar technologies within the same package for more optimal results. This is one of the most exciting areas within the industry.

“Advanced packaging technologies are providing the industry with a roadmap to continue Moore’s Law by improving the system performance, without only focusing on lithography shrinks.”

Memory recovers, finally?
Lastly, it has been quite a distressing time for memory, recently. Yole Développement said that in Q2 2019, the memory business was approaching the bottom. So, how will the memory market perform well in 2020?

Jelinek replied: “In 2020, the overall memory market is forecast to make a strong recovery. Although we will not surpass the record revenue on 2018, total memory will grow by 12% after a disastrous 2019, where revenue is forecast to decline by 30.3%. DRAM is forecast to grow by 9%, while NAND will grow by 17% in 2020.”

EMS 2.0: What’s next for electronics manufacturing?

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A typical electronics manufacturing assembly line generally consists of inspection, mechanical assembly, ICT, x-ray, post-SMT, automated optical inspection (AOI), reflow, PnP, solder paste inspection (SPI) and printer.

Today’s electronics product marketplace is somehow off-balance. Plant managers are feeling the pain. Key drivers of supply shortage include massive labor shortage and political instability. Key drivers of rising product demand include rise of the middle class, IoT and autonomous vehicles.

Bartosz Mazurek, VP Electronics Segment, Bright Machines, said that over 60 percent of plants are planning to focus on technology investments. They are looking to invest in workforce and acquire new technology. Automation in manufacturing is customized today. It drives cost, and is not completely flexible. There should be a much better way to manage the situation.

A typical manufacturing line.

Modular hardware way forward
A way forward is modular hardware. Bright Machines provides end-of-arm tools, such as grippers, screw driving, heat sink assembly, DIMM insertion, dispensing, soldering, labeling, functional testing, bar code reading, inspection, and tool changer. The feeding system consists of tray feeder and bowl feeder. The transport system comprises of an embedded conveyor, return conveyor and lift for conveyor. There are Bright robotic cells (BRCs) as well, such as BRC70 and BRC35.

Bright Machines has microfactories that are configured using modular hardware. The modular hardware approach is using Bright robotic cells. There is an intuitive programming and operation using the Brightware software. Brightware has integrated all of the elements. Next-gen automation is making the process very fast and does not require a highly-skilled expert. This enables you to get high-quality production, predictable production output, and provides an ability to scale.

Bright Machines highlighted two case studies. One, a heatsink assembly for telecom, where it provided a microfactory comprising one BRC and tray feeder. 33 percent more units were produced per hour, with 92 percent of fewer operations. Another, a case study of internal lighting and assembly for automotive. The solution was a microfactory, with four BRC and testing station.

Industry 4.0 all about digital transformation
Industry 4.0 is all about digital transformation. To enable this kind of a transformation, manufacturers have to improve their current automation capabilities. They need solutions that have to to be modular, flexible, re-usable and the time to deployment should be very short.

Data is becoming the currency of the future. Data should be collected in the cloud. Cloud-centric data enables real-time monitoring analytics. There should be configuration management, as well. This should be used across all deployments, moving forward. You also need robot teach, especially in the offline environment. The overall programming should happen in the offline environment.

You also need to do the overall programming in the offline digital twin environment, with real-physics simulation and remote deployment. Bright Machines helps customers transform their existing manufacturing process.

Memory market likely to improve in 2020: Micron

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Micron Technology Inc. recently celebrated the grand opening of its Global Development Center (GDC) in Hyderabad, India. The site will play a key role in contributing to the development of technologies behind breakthroughs in a wide range of areas, such as artificial intelligence (AI) and machine learning {ML).

Jeff VerHeul.

Jeff VerHeul, senior VP of Non-Volatile Engineering, Micron, said: “We are excited about the new data center. We are growing a substantial team. We are now approaching 200 engineers. We are giving major programs to teams here from day one. The wealth of talent in India is great. We have teams in Hyderabad and Bangalore.”

Speaking about the memory and storage markets, VerHeul added: “The ASPs have fallen. We have stated that there is strong demand, with improvement over the next year. We do look at the emerging memory technologies. Specifically, there are many parts, mobile products, emerging memory, etc.”

Dr. Scott DeBoer, executive VP, Technology & Products, Micron, added: “There is greater demand for memory densities. Higher performance and greater density is important for autonomous driving, etc. The need for memory expansion is great for applications.

Dr. Scott DeBoer.

“If you look at edge, there are power-sensitive needs. NV, with high performance, is needed. We do process development of memory technologies. Density, power, cost, etc., are all key.”

Micron is a user and manufacturer of IoT devices. At the edge, there is stringent demand for power. Micron sees that in many other applications as well, and consider the segment as a growing opportunity. More computes need to be enabled at the edge. From some applications, there is spectrum of needs. Some new and emerging memories combine latency, with fast power, compute.

Talking about autonomous driving, VerHeul said: “I am the owner of a Tesla 3. It does things that imply that, its not a flawless device. That’s about 3-5 years away. The rate of development of technology is growing very fast. It is also a case of regulatory hurdles.

“It may seem easy to think about taking a car from point A to point B. But, what happens on a snowy day? Does the car have to take into account the boundary conditions. Greater compute power and memory is required to make this fool proof. Micron is developing future memories.

“We are in partnership with Intel as of now. Our first system products are due in next few quarters. We also had a public project with Sony. We also had a project with STT MRAM with the Singapore Government. Certain memories are more applicable for embedded, and some for high density.”

DeBoer added: “We also have a mobile business, which is a robust one. We are doing the right things in working with the chipset partners and the OEM partners. We are aligning our offerings with their requirements. It should change the user behavior. A large part of smart manufacturing in semiconductors is within our facilities.”

NEF to provide common platform for electronics/semicon in India

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The VLSI Society of India (VSI), in collaboration with the India Electronics & Semiconductors Association (IESA), announced the Northern Region Electronics Forum (NEF) during Industry Day at Indian Institute of Technology, New Delhi on 21st September 2019.

NEF aims to provide a common platform for electronics/semiconductors industries, academia, research, and government bodies to expand the electronics/semiconductor ecosystem in the northern region of India.

Preet Yadav makes a point! On the dias (L-R): Pradeep Chakraborty, Jaswinder Ahuja, Prof. V. Ramgopal Rao and Sanjay Gupta.

Preet Yadav, VLSID Steering committee member – VLSI Society of India and Analog Practice Head, Wipro Ltd, said it’s a dream come true after almost four years of rigorous efforts, which started at VLSID 2016 conference at Kolkata, received a global boost during VLSID 2019 conference earlier this year at Delhi and became a reality today.

Stressing on importance of collaboration, he mentioned that industry, academia, research and government bodies are doing a lot of innovative work. If we bring together all these experts, we can reach out to bigger level of innovations with much less efforts and time.

He mentioned this journey was not possible without support from Jaswinder Ahuja and Sanjay Gupta. He thanked Prof. Ramgopal Rao for extending support to launch this forum and mentioned that IIT Delhi will be playing crucial role in this journey.

He thanked Prof. V. Ramgopal Rao, Jaswinder Ahuja, Sanjay Gupta, and Pradeep Chakraborty to be part of this ceremony. He also thanked the participants from various institutions for an interactive discussion on what next the NEF should target to best utilize this common platform.

Prof. Ramgopal Rao, director IIT Delhi, talked about the various possibilities of engagements with IIT Delhi, along with different government schemes like the Prime Minister Fellowship.

Jaswinder Ahuja, Corporate VP & MD, Cadence Design Systems, India, mentioned that as the technology is shrinking further, the focus is shifted towards more on system innovation than the technology front.

Pradeep Chakraborty, semicon/telecom consultant, requested the audience to try and develop a traffic-related product, to solve problems, while sharing an incident in Singapore that was related to the driverless car.

Sanjay Gupta, VP and India Country Manager, NXP Semiconductors, stressed on need of single standard for upcoming products like battery charging, automotive driver assistance systems (ADAS).

Some invited guests at the NEF event.

NEF will work with associated partners on:

Knowledge Sharing Seminar/Workshop on innovative technologies by experts
• Sessions by experts from across the globe
— Professors from reputed universities across the globe
— Product architects from semiconductor industry

Research Collaboration
• Joint research collaboration on common topics of interest

Joint Mentorship
• Joint mentorship by industry/academia for Ph. D scholars
• Internship in semiconductor industry

Participation in programs of interest
• Industry participation in academia events
• Academia participation in industry events

Startups/Entrepreneurs incubation
• Guidance to young entrepreneurs and Startups

Standardization of new technologies/ideas/processes
• Common interest group formation to work towards standardization of technologies/ideas/processes

Infrastructure resource sharing
• Sharing of resources like labs available in Industry & Academia based on mutual consent

Industry-ready pipeline creation
• Participation in curriculum review by industry
• To hold sessions about future skill requirements in
Industry to create an industry-ready engineering pipeline
• Focused skill placements drives

Latest government scheme proliferations
• Camps on latest government funding schemes for faculty and research scholars

•Industry-academia related schemes.

Please reach out to NEF @!