Toshiba Memory America Inc. has introduced the XFMEXPRESS today. The XFMEXPRESS is a new form-factor technology for removable, PCIe-attached, NVM Express (NVMe) memory devices developed by Toshiba Memory Corp. It aims to redefine the storage for ultra-mobile and embedded applications.
The launch took place at the ongoing Flash Memory Summit 2019 at the Silicon Valley’s premier convention center, the Santa Clara Convention Center, California, USA.
It offers a powerful combination of size, speed, and serviceability. Compact footprint includes low profile, small form-factor and an optimized mounting space. It supports PCIe 3.0 and 4.0, and PCIe x2 and x4 Lane. Removable design comes with an innovative hinge connector and a screw-less locking mechanism.
Need for new form factor?
Why do we need another form factor? It creates a best of both worlds — M2 SSDs and BGA SSDs. We are providing a new form factor that delivers an unparalleled combination of features designed to revolutionize ultra-mobile PCs, IoT devices and embedded applications.
XFMEXPRESS pairs removable memory functionality with a robust, compact package. It enables a new category of small memory devices and SSDs that are easy to service or upgrade. It will help diminish technical barriers and design constraints.
The XFMEXPRESS optimizes the mounting space for ultra-compact host devices without sacrificing performance or serviceability with a mobile-friendly footprint.
It provides leading-edge PCIe attached, NVMe performance. Having a flexible, future-proof design, XFMEXPRESS offers the necessary flexibility and scalability to stand the test of time. It is also designed to deploy current and future 3D flash memory sizes.
The XFMEXPRESS has an innovative connector design. The JAE (Japan Aviation Electronics Industry Ltd) is the development partner on the XFMEXPRESS connector design and manufacturing. Features include:
‒ Hinge type connector
‒ Low profile and small size
‒ Lock structure
‒ Device removal possible in a small space
‒ Designed to enhance heat dissipation
‒ Supports PCIe 4.0 (16GT/s).
The XFMEXPRESS form factor’s no-compromise size and low profile (14mm x 18mm x 1.4mm) offers a 252mm2 footprint, optimizing the mounting space for ultra-compact host devices without sacrificing performance or serviceability. With this minimized z-height, the XFMEXPRESS form factor is excellent for thin and light notebooks and creates new design possibilities for next-generation applications and systems.
The XFMEXPRESS target markets include notebook PCs — thin and light, and 2-in-1s, automotive — EDR and drive recorders, as well as IVI and ADAS, gaming consoles, such as VR and HMD, and others, such as portable storage, surveillance, AR/VR HMD, MFP, etc.
Toshiba Memory is demonstrating the XFMEXPRESS solution live at Flash Memory Summit, August 6-8 in booth #307.